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Tin Whisker
Workshop (June 1)
User/Supplier Workshop - Tin Whisker Mitigation (June 2)
IEEE Electronic Components and Technology Conference (ECTC)
Caesar's Palace, Las Vegas, NV
Workshop Overview:
With the move toward Pb-free electronics, a popular finish
for component terminations is 100% tin (Sn). However, pure
Sn coatings have a tendency to grow small filaments known
as "whiskers" that can bridge adjacent terminals
causing system failures. The International Electronics Manufacturing Initiative (iNEMI) formed three projects to work on this phenomenon:
Accelerated Test (attempting to develop tests to predict tin
whiskers); Modeling (attempting to understand basic cause
of whiskers); User Group (addressing how high-reliability,
long-life systems or critical applications can be protected
with today's knowledge).
The
Tuesday workshop (June 1) will provide an overview of more
than three years' work - from all three projects - investigating
all aspects of tin whiskers. Attendees will receive a good
overview of tin whiskers, including an annotated bibliography
(handout); a set of tests recommended to JEDEC; basic theories
behind whisker formation; and how to protect critical applications/systems
given what we know today.
On
Wednesday (June 2), the iNEMI Tin Whiskers User Group is sponsoring
a workshop relative to the need for mitigation practices when
100% tin is used as a component terminal coating. The concern
with tin whiskers in high-reliability, critical systems applications
will be discussed, potential solutions outlined (given today's
knowledge), and tests to demonstrate compliance will be proposed.
This workshop will have representatives from 10 of the largest
North American OEMs and will represent a consensus position
on their part. However, there are a number of options that
can be utilized to solve the tin whisker problem, and the
OEMs would like supplier feedback on the difficulty/cost of
implementing the various approaches. It is important that
we have knowledgeable representation from component suppliers
so that feedback and suggestions on these proposals can be
discussed.
In
addition to the two workshops, iNEMI's Tin Whisker Accelerated
Test Project will hold an open meeting (June 2) and the Tin
Whisker Modeling Project will hold a participants-only project
meeting (June 3). Meeting overview
Registration
All meetings will be held in the same venue as the IEEE
Electronic Components and Technology Conference (ECTC).
There is a fee of $75.00 per day, which will reimburse the
conference for the cost of continental breakfast, coffee breaks
and lunches. Attendees at the iNEMI workshop have access to
the ECTC block of rooms at Caesar's Palace. Reservations can
be made directly by calling 800-634-6661, or going to the
hotel website.
Information about the conference and the hotel is available
on the ECTC
website.
There
is no additional fee for attending the iNEMI meetings for those
who register for ECTC. iNEMI will provide special badges and
collect registration fee(s) from those who plan to attend
only the iNEMI meetings. The iNEMI badge will allow attendance
at the iNEMI meetings and the ECTC Technology Corner (which
includes poster papers), but not the ECTC technical sessions.
We expect to provide lunch tickets, receipts, and a CD-ROM
containing the presentations and bibliography when you pick
up your badge. Download
iNEMI registration form Link
to ECTC registration
Meeting
Highlights
- Tuesday,
June 1: Tin Whisker workshop (Carol Handwerker, NIST, moderating)
Agenda
- Wednesday,
June 2 (morning): User/Supplier workshop (Chairman Joe Smetana,
Alcatel, moderating)
___o Discussion of mitigation
strategy and acceptance test plan
- Wednesday,
June 2 (afternoon): Tin Whisker Accelerated Test Project
open meeting (Chairman Nick Vo, Motorola, moderating)
___o Papers by Nick
Vo, M. Dittes
___o Review test results
on DOE 3
___o General discussion
- Thursday,
June 3: Tin Whisker Modeling Project meeting (project participants
only) (Chairman George Galyon, IBM, moderating)
___o Discuss status
of models for tin whisker formation
___o Review available
test results
___o Plan for future
work
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