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... is an industry-led consortium of more than 70 electronics manufacturers, suppliers and related organizations.
Our mission: Forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.
List of iNEMI Members
iNEMI Overview
iNEMI Deployment Projects (updated April 2010)
Order the 2009 iNEMI Roadmap
2011 iNEMI Roadmap
iNEMI Roadmap Overview
iNEMI 2009 Annual Report
Member Information
 2009 iNEMI Roadmap
2009 iNEMI Technical Plan
Member newsletter
Participant Guidelines & Directory (April 2010) (PDF)
iNEMI Project Management Guidelines |
Web survey on copper wire bonding (please take survey before September 30, 2010)
iNEMI Member Newsletter (August 2010)
iNEMI Roadmap Newsletter (August 2010)
iNEMI Environmental Newsletter (July 2010)
End-of-Project Webinar: Built-In Self-Test (BIST) (July 14)
iNEMI Workshop Will Focus on Role of Electronics Industry in Development of Alternative Energies
Mark Kaltenbach named iNEMI consultant for project management
Click here for OEM/ODM Assistance Request for Dynamic Warpage of your PCBs
iNEMI Adds Consultant in Japan
iNEMIが日本にコンサルタントを採用
Presentations: iNEMI Council Meeting (04/13/10; Las Vegas, Nevada)
Presentations: iNEMI Test TIG Meetings (04/08/10; Las Vegas, Nevada)
Bill Bader interview with iConnect at APEX (04/07/10; Las Vegas, Nevada)
iNEMI Organizes Four New Packaging Initiatives
iNEMI Adds 10 New Members in First Quarter of 2010
End-of-Project Webinar: iNEMI Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project (03/31/10)
iNEMI Position on Product Carbon Footprinting
The Evolving Direction for Environmental Programs in the Electronics Industry, presented by Bob Pfahl (iNEMI) at the Systems Packaging Japan Workshop 2010; Kyoto, Japan (01/25/10)
End-of-Project Webinar: Board Flexure Standardization Project (01/20/10)
Webinar: Highlights from the 2009 iNEMI Environmentally Conscious Electronics Roadmap (12/15/09)
Organic Packaging Substrates Workshop - New Initiatives
Videos: iNEMI Environmental Leadership Forum; San Diego, California (10/08/09)
2009 Research Priorities Now Available
2009 Technical Plan Now Available
iNEMI Recognizes Tetsuro Nishimura for Nihon Superior’s Extraordinary Support of iNEMI Activities (11/05/09)
Presentations: iNEMI Board & Systems Manufacturing Test TIG Meetings, held at International Test Conference; Austin, Texas (11/05/09)
Presentations: Symposium on Global ICT Environmental Initiatives, sponsored by iNEMI and Intel; Brussels, Belgium (October 27-28, 2009)
Presentations: iNEMI Meetings in Asia (October 2009)
Presentations: iNEMI at IMPACT 2009; Taipei, Taiwan (October 2009)
End-of-Project Webinar: Boundary Scan Adoption Project (10/20/09)
End-of-Project Webinar: Boundary Scan Adoption Project (10/20/09)
Presentations: iNEMI Meetings at SMTAI (October 2009; San Diego, California)
Bill Bader Joins iNEMI as CEO
Bill Bader先生新任iNEMI首席执行官
End-of-Project Webinar - iNEMI Functional Test Coverage Assessment Project (08/12/09)
End-of-Project Webinar - iNEMI Lead-Free Rework Optimization, Phases 1 and 2 (08/05/09)
iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09) |
Teleconferences/Webinars
Teleconference: Copper Wire Bonding (US: September 1; Asia: September 2)
Teleconference: iNEMI Structural Test of External Memory Devices Project (Boundary Scan Adoption, Phase 2) (September 2)
Teleconferences: iNEMI Packaging Substrates TIG (September 7-10)
Teleconference: iNEMI Board Flexure Standardization Project, Phase 2 (September 9)
Teleconference: Connector Particle Thickness Investigation Project, Phase 1 (September 13)
End-of-Project Webinar: iNEMI Solder Paste Deposition, Phase 2 (US: October 13; Asia: October 14)
End-of-Project Webinar: iNEMI Pb-Free Wave Soldering, Phase 2 (October 14)
United States
iNEMI Alternative Energy Workshop (October 20-21; San Jose, California)
Europe
iNEMI Medical Packaging Workshop (September 16-17; Berlin, Germany)
iNEMI Session at Going Green - CARE INNOVATION 2010 (Vienna, Austria) (November 9)
Asia
iNEMI Taipei Meeting (October 19, Taipei, Taiwan)
Sign Up for New Projects
iNEMI Structural Test of External Memory Devices Project (Boundary Scan Adoption, Phase 2)
Board Flexure Standardization Project, Phase 2 (Guidelines for Printed Wiring Board Strain Gage Testing in Pb-Free Assemblies)
iNEMI Connector Particle Thickness Investigation Project, Phase 1
iNEMI Copper Wire Bonding Reliability Project, Phase 1
Organic Packaging Substrates
- Warpage
- Miniaturization
- Holistic Approach to Packaging
Creep Corrosion
Built-In Self-Test (BIST)
Characterization of Pb-Free Alloy Alternatives
PVC Alternatives
HFR-Free Leadership
- PCB Material
- Signal Integrity
Eco-Impact Evaluator for ICT Equipment
Board Coplanarity in SMT Project
Board Flexure Standardization Project
Pb-Free Component and Board Finish Reliability
Solder Paste Deposition Project
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