Calendar

Click here for presentations

Registration

The meeting in Taipei is open to industry.
Membership in iNEMI is not required for this meeting; however, all participants must register prior to participating in the meeting.

Click here to register.

Meeting background

A number of major OEMs have joined together with iNEMI in the HFR-Free Leadership project to assess the feasibility of a broad conversion to HFR-Free PCB materials. While IPC and JEDEC are developing halogen-free spec’s and numerous companies have compliant materials, significant questions remain regarding overall readiness to make a transition to these materials. Some of these questions are:

What electrical properties are needed to meet high speed signaling requirements?
With many HFR-free materials showing higher stiffness, what mechanical properties are needed to ensure system reliability isn’t degraded?
Can design modifications reduce sensitivity to electrical and material properties?

At a meeting held in Santa Clara, California on February 18, 2009, it was decided to:

Focus on establishing supply base feasibility by 2011.
Use weekly teleconference meetings to define a common test suite to identify acceptable materials.
Design a test board to characterize materials and identify where tradeoffs may be needed.
Hold two face-to-face meetings, one in the U.S. and one in Taiwan

Wednesday, April 1, 1:30-5:00 pm at APEX in Las Vegas, Nevada
Wednesday, April 15, 10:00 am – 4:15 pm at ITRI in Taipei, Taiwan

It also was agreed to establish two initiatives:

Signal Integrity Initiative: Steve Hall
PCB Material Development Initiative: John Davignon

This action was strongly supported by Dell, HP, Intel, and Cisco.

Click here for the presentations and minutes from the Feb 18th meeting.

Meeting objectives

The purpose of the Taipei meeting is to:

Increase Asian participation in the program
Review project objectives and plans
Update Signal Integrity and PCB Material initiative progress

Initiative Goals
Participating companies
Status of current work (progress, issues needing attention)
Plans/timelines to complete assignments

Schedule future meetings

Phone vs. face-to-face
Acceptable time for all geographies

Your participation will allow you to help set this agenda for the electronics industry. It will also allow your firm to help define the “technology envelopes” for:

Signal Integrity Requirements
PCB Material Requirements

Who should attend

Technical management and lead engineers from:

OEMs
ODMs and EMS Firms
PCB Fabricators
Laminate Manufacturers

Whose responsibilities include:

Materials reliability
Signal Integrity
Sourcing and supply chain management

Agenda
10:00 Introductions
10:15 Overview of iNEMI Project Formation Process
10:45 Overview of iNEMI HFR-Free Project Portfolio
11:00 Overview of iNEMI HFR-Free Leadership Program
11:30 Signal Integrity Status Update
12:00 PCB Material Status Update
12:30 Lunch
1:30    Signal Integrity and PCB Material Breakout Sessions
3:30    Reports from Breakout Sessions
4:00    Open Issues (future meeting schedule, etc…)
4:15    Adjourn

Map of local area

Hotel close to meeting

The Howard Plaza Hotel Taipei
+886 (2) 27000729
160 Jen Ai Road, Section 3
Taipei 10657 Taiwan
台北福華大飯店，仁愛路三段160号

Click here for additional information about iNEMI’s HFR-free initiatives.

Press Releases

iNEMI Meetings in Asia Focus on 2009 Roadmap and HFR-Free Initiatives

iNEMI在亚洲举行会议报告2009版路线图和无卤化阻燃剂项目

For additional information
Dr. Haley Fu
haley.fu@inemi.org
+86 21 5835 3839 (China)