Liquid Cooling Symposium
Sponsored by the iNEMI Heat Transfer TIG's Liquid Cooling Project
May 31, 2006, 7:00 p.m. - 9:00 p.m.
Executive Center 3
Sheraton San Diego Hotel & Marina

Liquid Cooling Project Team Meeting
June 2, 2006, 7:00 a.m. - 8:00 a.m.
Marina 5 Room
Sheraton San Diego Hotel & Marina

For more information, please contact:
     Michael Patterson, Intel (michael.k.patterson@intel.com)
     David Godlewski, iNEMI (dgodlewski@inemi.org)


Liquid Cooling Symposium

Agenda

iNEMI is pleased to announce a symposium on successful applications of liquid cooling in the electronics industry.  iNEMI’s Heat Transfer Technology Integration Group (TIG) is organizing this important event to gather information for a best practices document to be published by the TIG’s Liquid Cooling Project for the benefit of iNEMI members and the electronics industry.

The iNEMI project proposes to develop best practices from an overall systems approach of the hot side heat exchanger, including the pump or fluid driving device, and the tubing or fluid path.  These components represent the greatest challenge to commercialization of liquid cooling.  Areas such as reliability, system life, manufacturability, and cost are to be considered.  The group, in addition, proposes to limit its work to "in the product" liquid cooling and plans not to cover the interface between the electronic product and the environment as other groups (notably ASHRAE) are currently working this issue.

In addition to the symposium, the iNEMI Liquid Cooling Project will hold an open meeting June 2 (the morning after the symposium) to discuss and distill symposium presentations into key points for the best practices document.

Both meetings will be held at the Sheraton San Diego Hotel & Marina, concurrently with ITherm and ECTC.  Anyone attending the iNEMI meetings is encouraged to attend these conferences as well, as they will provide a wide range of technical programs in electronics and electronics cooling.

7:00 - 7:10 p.m.	Introduction Michael K. Patterson, Intel Corporation iNEMI Overview David Godlewski, iNEMI
7:10 - 7:25 p.m.	Experimental Performance of High Performance, Low Cost, Water-Cooled, Copper Micro-Channel Heat Sinks Ralph L. Webb and Hasan Nasir, Omega Piezo Technologies, Inc.
7:25 - 7:40 p.m.	An Integrated Cost-Effective Liquid Cooling Technology for CPU Cooling Ketan R. Shah, Intel Corporation
7:40 - 7:55 p.m.	Cold Plate Manufacturing—Factors that Drive Up Production Pricing Kathryn Whitenack, Lytron, Inc.
7:55 - 8:10 p.m.	Passive Two-Phase Liquid Cooling as an Alternative to Aqueous Forced Convection Phil E. Tuma, Application Development Specialist, 3M Electronics Markets Materials Division
8:10 - 8:25 p.m.	Artech Integrated Liquid Cooled Heatsink Gregg Kloeppel, Artech Inc.
8:25 - 8:40 p.m.	Cost Effective Design and Manufacture of Liquid Cooling Systems Michael Lee, Thermaltake Technology Co., Ltd.
8:40 p.m.	Forum Discussion

Download abstracts

Press release
iNEMI Liquid Cooling Symposium Will Discuss Successful Applications of Liquid Cooling (5/16/06)