This is an invitation to participate in or lead one of the new initiatives proposed from the iNEMI Organic Packaging Substrates Workshop in Nagoya, Japan in November 2009.  Six areas for potential industry collaborative initiatives were identified at the workshop.

New Initiative Opportunities (PDF)

Statement of Work Guidelines (PDF)

Please click on the link for each initiative to get the teleconferencing information.

1.  Warpage Qualification Criteria (Substrates, Package and Board Levels)

2.  Identification of Primary Factors of Warpage

3.  Wiring Density Program
          North America:  Wednesday, December 1, 4:00 pm PST

4.  Holistic Modeling Process
          North America:  Thursday, December 2, 16, 30
                    5:00 pm PST, 8:00 pm EDT
          Asia:  Fridays, December 3, 17, 31
                    9:00 am China

5.  Optimization of Time to Yield (Design, Materials, Packaging)
          No scheduled telecons

6.  Reliability Methodology for Substrates
          No scheduled telecons

Press release

iNEMI Organizes Four New Packaging Initiatives (04/07/10)

If you have any questions, please contact:

Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org

Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org