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... is an industry-led consortium of approximately 65 electronics manufacturers, suppliers and related organizations.
Our mission: Forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.
Order the 2009 iNEMI Roadmap
2011 iNEMI Roadmap
List of iNEMI Members
Member Information
 2009 iNEMI Roadmap
2009 iNEMI Technical Plan
Member newsletter
Participant Guidelines & Directory (October 2009) (PDF)
iNEMI Project Management Guidelines |
iNEMI 2009 Annual Report
iNEMI Member Newsletter (March 2010)
iNEMI Position on Product Carbon Footprinting
iNEMI Roadmap Newsletter (February 2010)
Upcoming Meetings Will Solicit Industry Input for the 2011 iNEMI Roadmap
The Evolving Direction for Environmental Programs in the Electronics Industry, presented by Bob Pfahl (iNEMI) at the Systems Packaging Japan Workshop 2010; Kyoto, Japan (01/25/10)
End-of-Project Webinar: Board Flexure Standardization Project (01/20/10)
Webinar: Highlights from the 2009 iNEMI Environmentally Conscious Electronics Roadmap (12/15/09)
Organic Packaging Substrates Workshop - New Initiatives
Videos: iNEMI Environmental Leadership Forum; San Diego, California (10/08/09)
2009 Research Priorities Now Available
2009 Technical Plan Now Available
iNEMI Recognizes Tetsuro Nishimura for Nihon Superior’s Extraordinary Support of iNEMI Activities (11/05/09)
Presentations: iNEMI Board & Systems Manufacturing Test TIG Meetings, held at International Test Conference; Austin, Texas (11/05/09)
Presentations: Symposium on Global ICT Environmental Initiatives, sponsored by iNEMI and Intel; Brussels, Belgium (October 27-28, 2009)
Presentations: iNEMI Meetings in Asia (October 2009)
Presentations: iNEMI at IMPACT 2009; Taipei, Taiwan (October 2009)
End-of-Project Webinar: Boundary Scan Adoption Project (10/20/09)
End-of-Project Webinar: Boundary Scan Adoption Project (10/20/09)
Presentations: iNEMI Meetings at SMTAI (October 2009; San Diego, California)
Bill Bader Joins iNEMI as CEO
Bill Bader先生新任iNEMI首席执行官
End-of-Project Webinar - iNEMI Functional Test Coverage Assessment Project (08/12/09)
End-of-Project Webinar - iNEMI Lead-Free Rework Optimization, Phases 1 and 2 (08/05/09)
iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09) |
Teleconferences/Webinars
Teleconferences: iNEMI Packaging Substrates TIG (six new initiatives) (March 8-12)
Teleconference: iNEMI Boundary Scan Adoption Initiative - Phase II - Memory Device Test (March 11)
Teleconference: iNEMI Board Flexure Initiative - Phase II (March 11)
Webinar: 2011 iNEMI Roadmap Automotive/Medical PEG (March 19)
End-of-Project Webinar: iNEMI Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project (March 31)
Teleconference: iNEMI Test Strategy Model Update Initiative (US: TBD; Asia: TBD)
United States
iNEMI Meetings at OFC/NFOEC 2010 Conference: iNEMI Optoelectronics TIG and iNEMI Optical Device Inspection & Cleaning Program (March 22; San Diego, California)
iNEMI Meetings at APEX (April 6-9; Las Vegas, Nevada)
iNEMI Council of Members Meeting and Webinar, hosted by Cisco Systems (April 13; San Jose, California)
Asia
Roadmap Workshop (June 8; Taipei, Taiwan)
Europe
Roadmap Workshop (June 16; Leuven, Belgium)
Organic Packaging Substrates
- Warpage
- Miniaturization
- Holistic Approach to Packaging
Creep Corrosion
Built-In Self-Test (BIST)
Characterization of Pb-Free Alloy Alternatives
PVC Alternatives
HFR-Free Leadership
- PCB Material
- Signal Integrity
Eco-Impact Evaluator for ICT Equipment
Board Coplanarity in SMT Project
Board Flexure Standardization Project
Pb-Free Component and Board Finish Reliability
Solder Paste Deposition Project
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