Session: Materials: Solder Joint Properties and Reliability I
Addressing Opportunities and Risks of Pb-Free Solder Alloy Alternatives
Authors: Gregory Henshall (Hewlett Packard); Robert Healey, Ranjit S. Pandher (Cookson Electronics); Keith Sweatman, Keith Howell (Nihon Superior); Richard Coyle, Joe Smetana (Alcatel Lucent); Thilo Sack, Polina Snugovsky (Celestica); Stephen Tisdale, Fay Hua (Intel) and Grace O'Malley (iNEMI)
Presented by Grace O'Malley (iNEMI)