Ronald W. Gedney, iNEMI Staff Consultant
Ron Gedney retired from iNEMI in 2002 and continues to be involved with several of our ongoing activities on a consulting basis. He joined the consortium in 1996, bringing with him nearly 40 years experience in the development, manufacturing and procurement of electronic components and packaging. The bulk of his career was spent at IBM, where he was responsible for taking one of IBM’s cost-oriented ceramic package programs and making it into the most popular LSI/VLSI device package in IBM with some 750 million chip carriers manufactured prior to his retirement (in 1992). Other assignments while with IBM included design of the company’s flex circuit manufacturing line; development of the low-end packaging strategy adopted across IBM Corporation; and creation of marketing programs for IBM’s electronic package products.
Mr. Gedney has several patents in electronic packaging and has authored or co-authored several book chapters and numerous technical articles. He is past president of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, past General Chair of the IEEE/EIA-sponsored Electronic Components and Technology Conference (ECTC), past Chair of the CPMT Binghamton Chapter, a Fellow of the IEEE, and a member of ASME and IMAPS. In 1999, Mr. Gedney received the IEEE CMPT Society’s David Feldman Outstanding Contribution Award in recognition of his continuous and meritorious service to the CPMT and electronic packaging technology. He was presented the IEEE third Millenium Medal in 2000, and received the Soldertec Gobal Lead-Free Solder Award in 2004 "in recognition of his leadership and technical expertise in eliminating lead from solder assemblies." He graduated from Tufts University with a degree in electrical engineering.
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