Fred Kuhlman, Delphi Electronics & Safety; Co-Chair, iNEMI Technical Committee
Fred Kuhlman has been co-chair of the iNEMI Technical Committee Meeting since 2003. Fred brings much experience in the area of electronics manufacturing for automotive electronics. He has 29 years experience in this field, including manufacturing process and test development and support. He also has experience on new product development teams and in designing new assembly lines. Fred has managed various core development groups including SMT process, Wave Soldering, Materials, Final Assembly and Factory Information Systems. He was instrumental in several key developments including a no-clean soldering process, a flip chip underfill process, a factory information system for the first automotive flip chip assembly line, an SMT quality prediction model, and lead-free SMT soldering. He is currently leading the application of Robust Engineering & Six Sigma methodologies to new process developments.
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