Nasser Grayeli, Chairman of the Board
Nasser Grayeli is Vice President of the Technology and Manufacturing Group and Director of Assembly Technology Development for Intel Corporation. He has served on the iNEMI Board of Directors since 1999 and was elected Chairman in March 2002.
Dr. Grayeli joined Intel in 1983 and has held numerous technical and management positions. Since 1999, he has been responsible for the company's packaging, assembly process, and materials and enabling technology development. Prior to that, he was manager of Materials/Supplier Technology Development, leading a team that worked with Intel's suppliers to improve technology development methodology and cycle time, increase yields and product quality, and reduce packaging costs.
In his previous positions with Intel, Dr. Grayeli managed the development of the company's tape carrier packaging technology, including the first six-inch wafer bump capability; and he was responsible for integrating back-end fab processes with assembly processes and developing several interconnect and mounting technologies.
In addition to his participation on the iNEMI board, Dr. Grayeli has been actively involved with other industry consortia. He was a mentor and Technology Advisory Board member for the Semiconductor Research Corporation (SRC) and was an assembly team member at SEMATECH.
Prior to joining Intel, Dr. Grayeli was a post-doctoral research affiliate at Stanford University and a member of a cross-disciplinary materials engineering, electrical engineering and applied physics research team developing non-destructive evaluation methods for application in various industries. He also worked at Parchin Chemical Factories as communication engineer.
Dr. Grayeli received his doctorate in 1981 in Materials Science and Engineering from Stanford University.
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