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Newsroom
NEMI/TMS/NIST Workshop
Tin Whiskers: Cause and Effect
Sunday, March 2, 2003
San Diego Convention Center


Minutes

Introduction: Dr. William Boettinger, NIST.

Stress in Electroplated Sn: Its Measurement and Implication in Spontaneous Whisker Growth: Chen Xu, Cookson Electronics PWB Materials and Chemistry.

Spontaneous Growth Of Tin Whiskers From Tin Electrodeposits On Phosphor Bronze Sheet: Dong Nyung Lee, School of Materials Science and Engineering, Seoul National University.

Tin-Whisker Microstructural Analysis using FIBs / Recrystallization Hypothesis: George T Galyon, IBM Server Group.

Focused Ion Beam, Transmission Electron Microscopy, and Synchrotron Radiation Study of Sn Whiskers on Leadframe with Pb-free Surface Finish: King N. Tu, W. J. Choi, and T. Y. Lee, Department of Materials Science and Engineering, UCLA.

Annotated Tin Whisker Bibliography and Anthology, Dr. George T. Galyon, IBM; (updated November 2003, v1.2)