Newsroom
Spanning the Virtual Factory: Managing Supply Chain Communications
(F-09)
Tuesday, January 22, 1:30-3:00 p.m., Room 24C
This panel, led by Barbara Goldstein, a strategic advisor for NIST and co-chair of NEMI's Virtual Factory Project, will demonstrate OEM/EMS collaboration using the newly released IPC Product Data eXchange (PDX) standards and RosettaNet Partner Interface Process™ (PIP®) specifications. These specifications, initiated by the IPC/NEMI Virtual Factory Project partnership, help provide standard interfaces for exchanging data within the manufacturing supply web so that companies can increase efficiencies, shorten time to market and improve return on investment. Panelists will demonstrate the use of the PDX standards and RosettaNet PIPs and discuss lessons learned from implementations.
- Barbara Goldstein, NIST (moderator)
- Doug Furbush, consultant
- Joanne Friedman, META Group
- Dan O'Neill, Lucent Technologies
Lead-Free Report (F-07)
Wednesday, January 23, 1:30-5:00 p.m., Room 24C
In January 2000, the NEMI Lead-Free Assembly Project recommended industry standard alloys as lead-free alternatives to the tin-lead solder widely used in electronic product assembly: Sn3.9Ag0.6Cu for reflow solder applications, Sn0.7Cu or Sn3.5Ag for wave solder applications. Since that time, the project has undertaken a concentrated program to enhance basic understanding of the reflow solder alloy and process in an effort to assist industry with timely implementation of lead-free assemblies. The project is nearing completion and this session will report on progress to date in the areas of solder joint modeling, reliability testing, process profiles and component compatibility. Presenters are:
- Edwin Bradley, Motorola
- Richard Parker, Delphi Electronics
- Carol Handwerker, NIST
- Jasbir Bath, Solectron Corporation
- John Sohn, NEMI (retired, Lucent Technologies)
CAD/CAM Data Convergence (F-13)
Thursday, January 24, 10:30 a.m.-12:15 p.m., Room 24C
At last year's APEX, NEMI kicked off a project with industry leaders to accelerate the convergence of competing approaches for CAD/CAM data exchange formats. Efforts have specifically focused on IPC's GenCAM™ standard and Valor's ODB++. This session features a panel of speakers who represent a broad cross-section of the organizations participating in the convergence effort: OEM, EMS, PWB fabricator and solution provider. Discussions will include how the industry sees this work, what differences are noted by industry segment, a review of progress to date, and identification of remaining work necessary to achieve broad industry deployment of a converged data exchange standard.
CAMX and XML Machine Communication Standard (F-08)
Thursday, January 24, 8:30-10:00 a.m.
In an IPC-sponsored session, Allan Fraser (Teradyne), chair of the NEMI Plug & Play Factory Project, will describe IPC's new CAMX standards (Computer Aided Manufacturing using eXtensible Mark-up Language). These standards, which comprise the IPC 2540 series, were proposed by the Plug & Play Factory Project to enable interoperability among hardware and software components used on the shop floor in electronics manufacturing. Linkages to associated standards such as GenCAM and PDX will show how IPC standards are addressing needs of its members to facilitate e-business and speed product delivery throughout the supply chain. In addition to this forum, several companies will be demonstrating use of the CAMX standards from the APEX show floor.
Tin Whiskers Forum (F-14)
Thursday, January 24, 10:15 a.m.-12:15 p.m., Room 28C
Tin-plated leads are desirable for lead-free electronics; however, the reliability issues associated with tin whisker formation must be controlled. The NEMI Tin Whisker Test Standardization Project was formed in 2001 to accomplish two tasks: (1) define an accelerated test for tin whiskers and (2) develop a basic understanding of the cause for tin whisker formation, leading to control of this phenomenon. This forum will present the results of the first set of tests completed by the project in its efforts to develop an accelerated test methodology. A status report on tin whisker modeling will also be presented.
For further information:
Cynthia Williams, NEMI
office: (207) 871-1260
cell: (207) 871-1260
email: cwilliams@mindspring.com