Newsroom
Visit NEMI at Booth #710
Flip Chip/Microvia Technologies Panel
Convention Center, Fifth Floor, Ballroom D
Thursday, October 29, 8:30-11:00 a.m.
Microvia/Flip Chip Forum Promotes Better
Understanding of Technologies to Encourage Implementation
NEMI and ITRI Co-Sponsor Event
Press Contacts at bottom of page
Providence, RI · October 29, 1998 · The National Electronics Manufacturing Initiative (NEMI) and the Interconnection Technology Research Institute (ITRI) are sponsoring an educational forum today on the use of microvia and flip chip technologies. The Flip Chip/Microvia Technologies Panel is part of the IPC/SMTA Electronics Assembly Expo.
"Direct chip attach with flip chip interconnects and the use of microvia technology to create dense, high performance printed wiring boards are the best solutions to the challenges of making electronic products smaller, more portable, higher performance and lower cost," says Marshall Andrews, chief executive officer of ITRI. "These are next generation electronic interconnection technologies, and everyone who is involved in electronics manufacturing will eventually have to understand and utilize them. This forum is an opportunity to find out what flip chip and microvia technologies are all about · who is supplying the necessary components, who is using the technology, when it works and when it doesn’t work · and to get a head start on implementation."
Focusing on real world issues relating to flip chip and microvia implementation, the NEMI/ITRI forum features a panel of executives from different segments of the electronics industry:
- Mark Anderson, Jabil Circuits, and Ron Gedney, NEMI: flip chip/microvia applications, including examples of high-volume applications from Intel, Motorola, HP, Micron and Delphi Delco
- Bruce Blaisdel, National Semiconductor: availability of bare die
- Peter Elenius, Flip Chip Technologies: wafer bumping capabilities & services
- Jack Fisher, ITRI: microvia board status and availability
"Education is an important part of deployment of a new technology," says Jim McElroy, executive director and CEO of NEMI. "People have to understand a technology before they can use it. They need to know the capabilities of the technology itself and be assured of its reliability. They also need to know what products are available and what infrastructure is in place to support the technology. With this forum, we are giving attendees the benefit of other companies’ experiences with microvia and flip chip."
About ITRI
The Interconnection Technology Research Institute (http://www.itri.org) is an industry-led consortium sponsored by the IPC for collaboration among the electronic interconnection industry, government and academia. Its purpose is to enhance the global competitiveness of the North American electronics interconnection industry by enabling collaboration among its members to accelerate development and application of revolutionary and evolutionary technology.
About NEMI
The National Electronics Manufacturing Initiative was formed in November 1994 to facilitate long-term North American leadership in electronics. The industry-led consortium is made up of more than 50 electronics equipment manufacturers, suppliers, associations, government agencies and universities. NEMI’s members represent a combined total of more than $200 billion in 1998 revenues and employ more than 1.25 million people.
NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps, and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.
For more information, please contact:
Cynthia Williams
207-871-1260
cwilliams@nemi.org
Ron Gedney
NEMI
703-834-2084
rgedney@nemi.org