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NEMI’s Director of Operations Receives IEEE Packaging Award
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Herndon, VA (June 3, 1999) · Ron Gedney, director of operations for the National Electronics Manufacturing Initiative (NEMI), today received the David Feldman Outstanding Contribution Award from the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. The award was presented at the 49th Electronic Components and Technology Conference in San Diego, Calif.
"The David Feldman award is given annually to an individual for outstanding contributions to the fields encompassed by the CPMT Society through invention, technical development or executive or managerial direction," explains Rao Bonda, chair of the IEEE CPMT awards committee. "Ron was chosen to receive this award in recognition of his continuous and meritorious service to the CPMT and electronic packaging technology."
An IEEE Fellow, Gedney has been a member of the organization since 1957, and has been actively involved in leadership of the CPMT Society since 1979, when he took over as chair of Technical Committee 6 (Electronic Packaging). In this role, he helped organize and chaired the first VLSI Packaging Workshop in 1980.
In 1988, Gedney was elected to CPMT’s Board of Governors and, in 1990, was elected president of the society. During his tenure as president, the CPMT Society initiated a packaging fellowship, sponsored by Motorola. Gedney also drove a number of financial reforms, which led to the society being able to hire a staff executive and develop a fund to cover travel expenses for the Board of Governors.
As chair of the Awards Committee (1992-96), Gedney developed several new awards: one for contributions to manufacturing technology, one for sustained technical contributions, an award for young engineers (under 35) for outstanding work in the society’s field of interest, plus two best paper awards for articles in the society’s refereed journals, the three-part IEEE CPMT Transactions.
In 1994, Gedney founded the Binghamton Chapter of CPMT and founded and chaired the Ball Grid Array Packaging Workshop, sponsored jointly by the CPMT Society and the chapter.
In his years of involvement, Gedney has held several other positions in the CPMT Society and is currently secretary and a member of the Board of Governors.
Gedney’s career includes 35 years with IBM in the development, manufacturing and procurement of electronic components and packaging. After retiring from IBM in 1992, he consulted with several major corporations and worked as a research analyst for the Integrated Electronics Engineering Center, State University of New York, in Binghamton. He joined NEMI in November of 1996.
Gedney is a graduate of Tufts University with a degree in electrical engineering. In addition to IEEE, he is a member of ASME and IMAPS.
About NEMI
The National Electronics Manufacturing Initiative was formed in November 1994 to facilitate long-term North American leadership in electronics. The industry-led consortium is made up of more than 50 electronics equipment manufacturers, suppliers, associations, government agencies and universities. NEMI’s members represent a combined total of more than $200 billion in 1998 revenues and employ more than 1.25 million people.
NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps, and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.
For further information, contact:
Cynthia Williams
207-871-1260
cwilliams@nemi.org