Newsroom
NEMI Roadmap Kick-Off Meeting Scheduled for March 17
Industry-Wide Meeting Begins Process of Identifying
Future Electronics Manufacturing Technology Needs
Press Contacts at bottom of page
Herndon, Va. · November 29, 1999 · The National Electronics Manufacturing Initiative (NEMI) has scheduled the kick-off meeting for Roadmap 2000. The meeting will be held at the Long Beach, Calif. Convention Center March 17, 2000, immediately following APEXSM, IPC SMEMA Council’s Electronics Assembly Process Exhibition and Conference.
Every two years, NEMI enlists the participation of professionals from OEMs and electronics manufacturing services (EMS) providers, as well as a host of technology solutions providers from the electronics manufacturing supply chain, to help anticipate future manufacturing technology needs. These individuals help identify key technology and infrastructure developments that will be required to ensure the competitiveness of electronics manufacturing companies in the region. The final roadmap serves as an important document to guide companies, government agencies, universities, and other funding organizations in setting priorities for future R&D investments.
"Participation in the roadmapping process is open to all companies or organizations based in North America, regardless of whether they are NEMI members," says Jim McElroy, executive director and CEO of NEMI. "For our roadmap to accurately reflect the state of the electronics industry, we need broad and diverse input from the industry, and we try to encourage as many participants in this process as we possibly can."
Prior to the March kick-off meeting, five product sector groups will meet to define specifications for future products in five sectors: low-cost, hand-held, cost/performance, high-performance and harsh environment. At the kick-off meeting, the product sector groups will present the the product profiles they have developed. Participants then meet with one of the Technology Working Groups (TWGs) to begin the work of roadmapping their particular area.
- Board assembly
- Digital silicon technology
- Energy storage systems
- Environmentally conscious manufacturing
- Factory information systems
- Final assembly
- Interconnect substrates · ceramic
- Interconnect substrates · organic
- Mass data storage
- Modeling, simulation & design tools
- Optoelectronics
- Packaging
- Passive components
- RF components
- Supply chain management
- Test, inspection & measurement
- Thermal management
After the initial meeting, the TWGs teleconference regularly to develop their roadmaps. One more face-to-face meeting is held in June; and roadmap chapters are submitted in October. The roadmap is assembled, edited and published by the end of December.
Anyone interested in participating in one of the Technology Working Groups should call the NEMI Secretariat, 703-834-0330, or email info@nemi.org.
About NEMI
The National Electronics Manufacturing Initiative was formed in November 1994 to facilitate long-term North American leadership in electronics. The industry-led consortium is made up of more than 50 electronics equipment manufacturers, suppliers, associations, government agencies and universities. NEMI’s members represent a combined total of more than $200 billion in 1998 revenues and employ more than 1.25 million people.
NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps, and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.
For further information, contact:
Cynthia Williams
207-871-1260
cwilliams@nemi.org
Ron Gedney
NEMI
703-834-2084
rgedney@nemi.org