Newsroom
NEMI Kicks Off Roadmap 2000 at Long Beach Meeting March 16-17
Gargini and Markus Keynote Opening Session
Press Contacts at bottom of page
HERNDON, Va. · Feb. 23, 2000 · The National Electronics Manufacturing Initiative (NEMI) kicks off Roadmap 2000 March 16 and 17 at the Long Beach, Calif. Hyatt. Keynote speakers Paolo Gargini of Intel and Karen Markus of Cronos Integrated Microsystems are scheduled to speak at the opening session Thursday evening, March 16, followed by a day-long working session on Friday. Hosted by IPC, this kick-off meeting immediately follows APEXSM, IPC SMEMA Council’s Electronics Assembly Process Exhibition and Conference (Long Beach Convention Center, March 13-17).
The two keynote speakers have been recruited to address industry developments that might significantly influence the roadmap development. Gargini will discuss packaging expectations from the silicon perspective based on the 1999 Semiconductor Roadmap published by the Semiconductor Industry Association (SIA). Markus will talk about the challenges of packaging for microelectromechanical systems (MEMS), in preparation for introducing MEMS technology into NEMI’s 2000 Roadmap.
Every two years, NEMI enlists the participation of professionals from OEMs and electronics manufacturing services (EMS) providers, as well as a host of technology solutions providers from the electronics manufacturing supply chain, to help anticipate future manufacturing technology needs. These individuals identify key technology and infrastructure developments required to ensure the competitiveness of electronics manufacturing companies in the region. Participation in the roadmapping process is open to all companies or organizations based in North America, regardless of NEMI membership.
"NEMI’s vision is to ensure a world-class electronics manufacturing environment in North America that is competitive for high-volume electronics markets," says Dave Lando, chairman of the NEMI board of directors and Engineering and Environmental Technology vice president for Lucent Technologies. "The NEMI roadmap is a critical element of this process since it allows us to identify where major gaps may be developing that could impact the capabilities of the supply infrastructure in North America as well as the competitiveness of downstream industries such as automotive, computers, telecommunications and aerospace/defense. The NEMI roadmap serves as an important document to guide companies, government agencies, universities, and other funding organizations in setting priorities for future R&D investments. Broad participation from industry and academia is necessary in order to continue to produce an accurate, credible and balanced NEMI roadmap."
Five product sector groups have been working since the end of 1999 to define specifications for future products: low-cost, hand-held, cost/performance, high-performance and harsh environment. Heading these efforts are:
- Low-cost: Ron Evans, 3COM, chair
- Hand-held: John Thome, Motorola, chair
- Cost/Performance: George Arrigotti, Intel, chair
- High-Performance: Evan Davidson, IBM, chair; and Mark Brillhart, Cisco, co-chair
- Harsh Environment: DHR Sarma, Delphi Delco, chair; and Bill Murphy, Lockheed Martin, co-chair
At the kick-off meeting, the product sector groups will present the product profiles they have developed. Participants then meet with one of the Technology Working Groups (TWGs) to begin the work of roadmapping their particular areas. The TWGs for Roadmap 2000 (and their chairs) are:
- Board assembly (Linda Klober, Celestica)
- Digital silicon technology (Paolo Gargini, Intel)
- Displays (Bob Pinnel, US Display Consortium)
- Energy storage systems (Lynn Davis, Motorola)
- Environmentally conscious manufacturing (Bob Pfahl, Motorola)
- Factory information systems
- Final assembly (Mike Reagin, Delphi-Delco)
- Interconnect substrates/ceramic (Rene Cote, DuPont)
- Interconnect substrates/organic (Jack Fisher, ITRI)
- Mass data storage (Roger Hoyt, IBM)
- Modeling, simulation & design tools (Joe Carey, Lucent Technologies)
- Optoelectronics (John Stafford, Motorola)
- Packaging (Alex Oscilowski, K&S)
- Passive components (Larry Marcanti, Nortel Networks)
- RF components (Vijay Nair, Motorola)
- Supply chain management (Dave Musso, Intel)
- Test, inspection & measurement (John Fulton, Compaq)
After the initial meeting, the TWGs teleconference regularly to develop their roadmaps. One more face-to-face meeting is held in June; and roadmap chapters are submitted in October. The roadmap is assembled, edited and published by the end of December.
Anyone interested in participating in one of the Technology Working Groups should call the NEMI Secretariat, 703-834-0330, or email info@nemi.org.
For further information, contact:
Cynthia Williams
207-871-1260
cwilliams@nemi.org
Ron Gedney
NEMI
703-834-2084
rgedney@nemi.org