Newsroom
NEMI’s Lead-Free Project Builds Momentum
Texas Instruments Joins Project; NEMI Reaches
Out to University-Based Research Groups
Press and Project Contacts at bottom of page
HERNDON, VA—August 29, 2000—The National Electronics Manufacturing Initiative (NEMI) today announced that Texas Instruments has joined the consortium’s Lead-Free Assembly Project. In addition, the project’s Alloy Group is launching a campaign to solicit information from university research programs to help build a database for the tin/silver/copper alloy (Sn3.9Ag0.6Cu) recommended as a standard replacement for tin/lead solder.
Texas Instruments’ primary area of interest is the Lead-Free Assembly Project’s Components Group, which is active on several fronts. Currently, the group is working with ITRI (Interconnection Technology Research Institute) to evaluate surface finishes and laminate materials for printed wiring boards (PWBs) used in lead-free electronics assemblies. ITRI is assessing test vehicles to determine the finishes and laminates most compatible with lead-free solder. Results are expected this fall.
Also this fall, the Components Group will be ranking cost-effective lead-free component/PWB terminations (based on compatibility with the recommended lead-free solder system) and plans to provide testing for specific components and PWBs to assess their reliability. In addition, the group will work with JEDEC, IPC and other related standards bodies to adapt standards that reflect processing parameters associated with use of lead-free solder and high temperature rated components and PWBs.
In addition to Texas Instruments, participants in NEMI’s Lead-Free Assembly Project include: Alcatel CID (formerly Newbridge Networks Corporation) Alpha Metals, Celestica, Inc., ChipPAC Incorporated, Compaq Computer Corporation, CTS Corporation, Delphi Electronics, Eastman Kodak Company, FCI Electronics, Heraeus, IBM Corporation, Integrated Electronic Engineering Center (IEEC) at SUNY-Binghamton, Indium Corporation of America, Intel Corporation, ITRI, Johnson Manufacturing Company, Kester Northrop Grumman, Lucent Technologies, Inc., Motorola, National Institute of Standards and Technology (NIST), SCI Systems, Inc., Shipley Ronal Company, Solectron Corporation, Storage Technology Corporation, Universal Instruments Corporation and Vitronics Soltec.
Alloy Database
The Lead-Free Assembly Project’s Alloy Group is building a database on the recommended SnAgCu solder and is contacting university-based research programs for information in two key areas. First, the group needs additional data on the mechanical/materials behavior of the alloy and, second, is looking for data on a wider range of lead-free alloy properties which NIST will assemble into a publicly available database.
"The Alloy Group realizes that we have neither the time nor the resources to totally characterize the recommended SnAgCu system; however, industry needs this kind of data in order to incorporate this lead-free solder into their products," says Carol Handwerker, leader of the Alloy Group and chief of NIST’s Metallurgy Division. "We see our role as that of a clearinghouse for data. We have already pulled together information from a number of sources and are developing a database that can be used by industry. In contacting university programs, we hope to not only identify additional data to be used, but also to encourage new research in this area."
About NEMI’s Lead-Free Assembly Project
The NEMI Lead-Free Assembly Project was launched in 1999 to help North American companies develop the capability to produce lead-free products by 2001, with an eye toward total lead elimination by 2004. The goals and focus of the project were determined by the findings of NEMI’s 1998 roadmap and an industry task force formed by NEMI to investigate process and material considerations of lead-free electronics assemblies. The task force investigated past efforts and developed a program plan to address lead-free electronics manufacturing solutions, which is now being implemented by the Lead-Free Assembly Project. Project work is organized into five groups:
- Alloy Group—select a lead-free alloy, pursue industry standard, gather data
- Reliability Group—selected testing, improve confidence levels
- Components Group—assess issues, develop database
- Process Group—propose manufacturing process for new alloy
- Legislative Group—monitor worldwide legislation (joint with the Electronics Industry Association).
According to Jim McElroy, CEO of NEMI, "One of the measures of a successful industry collaboration is the continued interest of both the existing member companies as well as new participants (such as Texas Instruments). Based on the progress of our work and the exchange of information that we had at the recent global coordination meeting held at SemiCon West, we are confident that our lead-free effort is on the right track and is well positioned to deliver the information needed by the electronics industry to help companies transition to lead-free assembly processes if they choose to do so."
About NEMI
The National Electronics Manufacturing Initiative’s mission is to facilitate long-term North American leadership in electronics. The industry-led consortium is made up of more than 50 electronics equipment manufacturers, suppliers, associations, government agencies and universities.
NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps, and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.
Project participation:
Ron Gedney
NEMI
703-834-2084
rgedney@nemi.org
Press information:
Cynthia Williams
207-871-1260
cwilliams@nemi.org