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Modeling and Data Needs of Lead-Free Solders
is Focus of Upcoming Workshop
NEMI, NIST, NSF and TMS Sponsor Forum in February
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Herndon, Va. — January 29, 2001 — The National Electronics Manufacturing Initiative (NEMI) is encouraging participation in an upcoming workshop that will identify the types of data needed to enable implementation of lead-free solders. Scheduled for February 15 in New Orleans, the workshop is sponsored by NEMI, the National Institute of Standards and Technology (NIST), the National Science Foundation (NSF) and The Minerals, Metals & Materials Society (TMS).
"The electronics industry’s move toward lead-free solders has created a need for fundamental data that accurately describes the behavior of these alloys in solder joints and that can be used to develop appropriate reliability models," said Ron Gedney, vice president of operations for NEMI. "NEMI’s Lead-Free Assembly Project and NIST are working together to create a single database of the physical and mechanical property data that have been developed by researchers around the world. As part of this activity, we have identified a preliminary list of data needed for the Sn-Ag-Cu alloys the NEMI project has recommended as the standard alloys for reflow and wave soldering."
Dr. Carol Handwerker, chief of NIST’s Metallurgy Division and leader of the Alloy Group of NEMI’s Lead-Free Assembly Project, said the goals of the workshop are to:
- define the state of the art in reliability modeling and mechanical property measurements of lead-free solder joints
- determine the "necessary and sufficient" experimental data modelers need
- describe the changes needed to improve modeling and data, including failure criteria
- develop a consensus on the best test methods for collecting needed data
- complete the assessment of missing high priority data
"There is considerable data, particularly with respect to mechanical properties, still needed by industry to be able to implement lead-free solders," said Handwerker. "We are looking to this workshop to provide a roadmap for research in the reliability of lead-free solders."
Anyone interested in attending the workshop should contact Linda Jessup at NEMI (703-834-2086 or Linda.Jessup@nemi.org). There is no registration fee.
About NEMI’s Lead-Free Assembly Project
The NEMI Lead-Free Assembly Project was launched in 1999 to help North American companies develop the capability to produce lead-free products by 2001, with an eye toward total lead elimination by 2004. The goals and focus of the project were determined by the findings of NEMI’s 1998 roadmap and an industry task force formed by NEMI to investigate process and material considerations of lead-free electronics assemblies. The task force investigated past efforts and developed a program plan to address lead-free electronics manufacturing solutions, which is now being implemented by the Lead-Free Assembly Project. Project work is organized into five areas:
- Alloy Group — select a lead-free alloy, pursue industry standard, gather data
- Reliability Group — conduct selected testing, improve confidence levels
- Components Group — assess issues, develop database
- Process Group — propose manufacturing process for new alloy
- Legislative Group — monitor worldwide legislation
The agenda is available for download below (updated 02-07-01):
About NEMI
The National Electronics Manufacturing Initiative’s mission is to facilitate leadership of the North American electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of more than 50 electronics equipment manufacturers, suppliers, industry associations and consortia, government agencies and universities.
NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.
For further information:
Cynthia Williams
cwilliams@nemi.org
phone: 207-871-1260