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NEMI Projects Showcased in Free Forums at APEX 2002
Final Lead-Free Report, GenCAM/ODB++ Convergence Results, Tin Whiskers and
Newly Published Product Data eXchange Standards are Topics of Discussion
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HERNDON, Va. · December 10, 2001 · The results of two National Electronics Manufacturing Initiative (NEMI) projects will be discussed for the first time publicly at IPC SMEMA Council's APEX 2002 conference in San Diego next month (January 20-24). NEMI's Lead-Free Assembly Project is scheduled to present findings from its two-year research effort; and the Data Exchange Convergence Project will report on a year-long industry initiative to converge competing approaches for CAD/CAM data exchange formats.
Additional forums are planned by NEMI's Virtual Factory Information Interchange Project and the recently formed Tin Whiskers Project. The Virtual Factory group will discuss implementations of IPC's Product Data eXchange standards for supply chain communication, which were published in October. The Tin Whiskers forum will focus on initial results from efforts to develop an accelerated test methodology, and the work done to date on tin whisker modeling.
"The Lead-Free, Virtual Factory and Convergence projects have been some of NEMI's most active over the past two years. They represent thousands of hours of effort by hundreds of individuals from all segments of the electronics manufacturing industry, and the resulting contributions they are making to industry are significant," said Jim McElroy, executive director and CEO of NEMI. "Similarly, the Tin Whiskers Project, which was organized in 2001, is already attracting industry attention and participation. APEX is an excellent setting in which to share results from these efforts. It draws the major players from the North American electronics assembly industry and provides an excellent forum for discussion and collaborative efforts."
The NEMI-sponsored sessions are part of the free forums offered at APEX. Schedules and topics follow.
Spanning the Virtual Factory: Managing Supply Chain Communications (F-09)
Tuesday, January 22, 1:30-3:00 p.m.
This panel, led by Barbara Goldstein, a strategic advisor for NIST and co-chair of NEMI's Virtual Factory Project, will demonstrate OEM/EMS collaboration using the newly released IPC Product Data eXchange (PDX) standards and RosettaNet Partner Interface Process™ (PIP®) specifications. These specifications, initiated by the IPC/NEMI Virtual Factory Project partnership, help provide standard interfaces for exchanging data within the manufacturing supply web so that companies can increase efficiencies, shorten time to market and improve return on investment (ROI). Panelists will demonstrate the use of the PDX standards and RosettaNet PIPs and discuss lessons learned from implementations.
Lead-Free Report (F-07)
Wednesday, January 23, 1:30-3:15 p.m.
In January 2000, the NEMI Lead-Free Assembly Project recommended Sn3.9Ag0.6Cu (and Sn0.7Cu or as Sn3.5Ag for wave flow applications) as an industry standard alternative to the tin/lead solder widely used in electronic product assembly. The project then undertook several projects to enhance basic understanding of the material and assure its reliability, in an effort to assist industry with timely implementation of lead-free assemblies. This session will report results of the group's solder reliability study, reflow process characterization and development of a lead-free database (coordinated by NIST) for reliability modeling. Presenters are:
- Edwin Bradley, Motorola
- Richard Parker, Delphi Electronics
- Carol Handwerker, NIST
- Jasbir Bath, Solectron Corporation
- John Sohn, NEMI (retired, Lucent Technologies)
CAD/CAM Data Convergence (F-13)
(Thursday, January 24, 10:30 a.m. - 12:15 p.m.)
At last year's APEX, NEMI kicked off a project with industry leaders to accelerate the convergence of competing approaches for CAD/CAM data exchange formats. Efforts have specifically focused on IPC's GenCAM™ standard and Valor's ODB++. This session features a panel of speakers who represent a broad cross-section of the organizations participating in the convergence effort: OEM, EMS, PWB fabricator and solution provider. Discussions will include how the industry sees this work, what differences are noted by industry segment, a review of progress to date and identification of remaining work necessary to achieve broad industry deployment of a converged data exchange standard.
CAMX and XML Machine Communication Standard (F-08)
Thursday, January 24, 8:30-10:00 a.m.
In a related, IPC-sponsored session, Allan Fraser (Teradyne), chair of the NEMI Plug & Play Factory Project, will describe IPC's new CAMX standards (Computer Aided Manufacturing using eXtensible Mark-up Language). These standards, which comprise the IPC 2540 series, were proposed by the Plug & Play Factory Project to enable interoperability among hardware and software components used on the shop floor in electronics manufacturing. Linkages to associated standards such as GenCAM and PDX will show how IPC standards are addressing the needs of its members to facilitate e-business and speed product delivery throughout the supply chain. In addition to this forum, several companies will be demonstrating use of the CAMX standards from the APEX show floor.
Tin Whiskers Forum (F-14)
Thursday, January 24, 10:15 a.m.-12:15 p.m.
Tin plated leads are desirable for lead-free electronics; however, the reliability issues associated with tin whisker formation must be controlled. The NEMI Tin Whiskers Project was formed in 2001 to accomplish two tasks: (1) define an accelerated test for tin whiskers and (2) develop a basic understanding of the cause for tin whisker formation, leading to control of this phenomenon. This forum will present the results of the first set of tests that the NEMI project has completed in its efforts to develop an accelerated test methodology. A status report on tin whisker modeling will also be presented.
About NEMI
The National Electronics Manufacturing Initiative's mission is to facilitate leadership of the North American electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of more than 60 electronics equipment manufacturers, suppliers, industry associations and consortia, government agencies and universities.
NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about NEMI, visit www.nemi.org.
Press contact:
Cynthia Williams
phone: 207-871-1260
cwilliams@nemi.org