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For further information: Cynthia Williams, NEMI 207-871-1260 cynthiaw@maine.rr.com.com

NEMI Schedules "Gap Analysis" Meetings at APEX

Meetings are Open to Industry and Will Help Define
Actions Needed to Close Technology and Infrastructure Gaps

HERNDON, Va. - March 19, 2003 - The National Electronics Manufacturing Initiative (NEMI), an industry-led consortium focused on strengthening the North American supply chain, has scheduled "gap analysis" meetings as a follow-up to the findings of its 2002 roadmap. Several of the meetings will be held at the upcoming APEX 2003 conference in Anaheim, Calif., March 31 through April 2.

The 2002 NEMI roadmap, which will be available to non-members March 31, covers 18 technology, business practice and infrastructure areas, identifying the future manufacturing technology needs in each of these areas. By comparing technology trends with anticipated product needs, the roadmap identifies "gaps" and "showstoppers" that potentially threaten the competitiveness of electronics product realization in the North American region.

"The gap analysis meetings are a very important part of the NEMI process," said Jim McElroy, executive director and CEO of NEMI. "Our biannual roadmaps identify industry needs, then we follow up with these in-depth gap discussions to develop action plans that will address the needs and help close the gaps identified by the roadmapping process."

McElroy says that follow-up activities may include, for example, university R&D, NEMI workshops, or NEMI deployment projects. "We determine what is within the scope and influence of NEMI and set a course to move the industry forward. In some instances, the best course of action may not be a NEMI-sponsored activity. Instead, we may make recommendations to other industry organizations or to R&D funding agencies."

The topics that will be discussed at APEX are: (1) board assembly, (2) substrates, including embedded passives, and (3) product lifecycle information management, which covers supply chain communication, factory information systems and other information management topics.

In addition to the gap analysis meetings, NEMI will hold several other forums and open project meetings at APEX. McElroy will discuss highlights of the 2002 NEMI roadmap at an IPC luncheon on April 2. There are two free forums, which are part of the APEX program - Spanning the Virtual Factory (session F11 on April 1) and the Test Strategy Project Forum (session F07-B, also on April 1). NEMI project teams sponsoring industry discussions are: Tin Whisker Accelerated Test Project and User Group, Flip Chip and CSP Underfill Technology Initiative, Optoelectronics for Substrates Study and the Optoelectronic Soldering Automation Project. Table 1 provides a schedule of all NEMI open meetings planned for APEX. Additional details are available on the NEMI website (http://www.nemi.org/).

About NEMI

The National Electronics Manufacturing Initiative's mission is to facilitate leadership of the North American electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of approximately 65 electronics manufacturers, suppliers, industry associations and consortia, government agencies and universities. NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about NEMI or the NEMI 2002 roadmap, visit www.nemi.org.

Topic
Date/Time
Location (Room)
Meeting Type
Board Assembly Monday, March 31 3:15-5:15 pm Hilton-Santa Barbara gap analysis
Substrates (including embedded passives) Monday, March 31 3:15-5:15 pm Hilton-San Simeon A gap analysis
Spanning the Virtual Factory Tuesday, April 1 10:45 am-12:15 pm Convention Center Room 201 D APEX free forum (F11)
Test Strategy Project Forum Tuesday, April 1 3:15-5:15 pm Convention Center Hall E, Room 6 APEX free forum (F07-B)
Tin Whisker Accelerated Test Project and Tin Whisker User Group Wednesday, April 2 8:00 a.m.-5:00 pm Hilton-Santa Monica project information review
Flip Chip & CSP Underfill Technology Wednesday, April 2 9:00-10:30 am Hilton-Oceanside project information review
NEMI roadmap discussion Wednesday, April 2 12:00-1:30 pm Hilton-Pacific Ballroom IPC Committee Luncheon (ticket required)
Product Lifecycle Information Management / Business Initiatives Wednesday, April 2 1:30-5:30 pm Hilton-San Clemente gap analysis
Substrates April 2 1:30-3:00 pm Oceanside (& teleconference) information review
Optoelectronic Soldering Automation Wednesday, April 2 1:30-3:00 pm Hilton-Capistrano B (& teleconference) project information review

All meetings are held in the Anaheim Convention Center or the Hilton Anaheim (adjacent to the convention center).