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2007 iNEMI Roadmap is Off to a Strong Start
New chapter on organic and printed electronics plus broader international participation are features of this latest edition
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IPC PRINTED CIRCUITS EXPO / APEX / DESIGNERS SUMMIT, Anaheim, Calif. (February 8, 2006) — The International Electronics Manufacturing Initiative (iNEMI) kicked off North American activities for its 2007 Roadmap February 6-7 at a meeting held in conjunction with the Printed Circuits Expo / APEX / Designers Summit conference in Anaheim, Calif. Industry experts met to discuss product sector needs and to kick off the efforts of the Technology Working Groups (TWGs), which will produce the chapters for the 19 technology and infrastructure areas that will be covered by the 2007 iNEMI Roadmap.
New this year is a chapter on organic and printed electronics technology. Chaired by Dan Gamota of Motorola, this TWG will focus on the technologies required to produce flexible electronic media, print conductive inks resulting in active components (such as transistors), and print organic materials onto flexible substrates. This emerging area of electronics is initially being used for inventory control (e-packaging and e-labeling), digital paper and signage, displays, and novelty and marketing applications. However, most products are currently in the prototype stage and not yet in volume production. The 2007 iNEMI Roadmap will look at the technology and infrastructure requirements for volume production of these types of products.
Also new for this roadmap cycle, iNEMI is broadening its efforts to recruit participation from Europe and Asia in order to create a more global picture of the electronics manufacturing industry. iNEMI first began proactively soliciting global participation for the 2004 Roadmap, which included input from organizations such as Fraunhofer IZM and IMAPS-Europe. This cycle, iNEMI is further expanding international involvement in roadmap development. An initial European meeting was held at Productronica last November (in Munich), and workshops are planned in Europe and Asia this spring and summer. (See preliminary schedule at the end of this announcement.)
Finally, iNEMI is coordinating with ITRS (International Technology Roadmap for Semiconductors) to standardize terms and approaches for forecasting between the two roadmaps. In particular, the two groups are coordinating to more closely align "design drivers" (ITRS) and "product emulators" (iNEMI).
"With each cycle, we learn from the previous roadmap, improve the process and, in doing so, improve our end result," said Chuck Richardson, staff manager of roadmapping for iNEMI. "We also adapt the roadmap to reflect emerging technologies and industry trends, as we have done with the addition of the new chapter this year. These changes help us ensure that the roadmap anticipates, and remains relevant to, changing industry needs."
About the iNEMI Roadmap
Since 1994, iNEMI has mapped the future manufacturing technology needs of the global electronics industry in an effort to identify key technology and infrastructure developments needed to ensure the competitiveness of the supply chain over the next decade. The roadmap continues to be the foundation of all iNEMI activities. It forecasts major trends in the evolution of technology across numerous disciplines, and this information is used to identify critical technology and infrastructure gaps, prioritize R&D needs to meet these gaps, and initiate activities that address industry needs.
Roadmap efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups (TWGs). The five PEGs, each chaired by a major OEM in the specific sector covered, define the future technology needs of "virtual products" from five areas: 1) portable/consumer, 2) office/large business systems/communications, 3) automotive, 4) aerospace/defense, and 5) medical products. Each PEG chapter forecasts future product attributes, including cost and density drivers.
The TWGs forecast trends for 19 technology and infrastructure areas, and contrast technology trends with anticipated product needs. Composed of experts from OEMs, EMS providers, suppliers, government agencies, universities and related consortia/trade associations, the TWGs predict the evolution of technology and/or business practices, identify gaps and "showstoppers" in existing technology and infrastructure, and develop recommendations for their respective areas. For more information about the 2007 iNEMI roadmap, go to http://www.inemi.org/cms/roadmapping/2007_iNEMI_Roadmap.html
The PEGs and TWGs typically meet by teleconference, sometimes as often as once a week. Limited travel is required of the group chairs, and there are only two face-to-face meetings scheduled that include all PEG and TWG members (the kick-off meeting held this week and a review meeting, which has been scheduled for May 17 at iNEMI’s headquarters in Herndon, Va.).
Anyone interested in getting involved in the 2007 Roadmap should contact Chuck Richardson at chuck.richardson@inemi.org. iNEMI membership is not required to participate in the roadmap.
About iNEMI
The International Electronics Manufacturing Initiative’s mission is to assure leadership of the global electronics manufacturing supply chain. Based in Herndon, Va. (in the Washington, DC area), the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, university and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI, visit www.inemi.org.
2007 iNEMI Roadmap Meeting Schedule
| April 5 |
One-day workshop in Europe (at SEMICON Europa, Munich) |
May 17 |
One-day workshop in North America (Herndon, Virginia) |
Week of June 26-30 |
One-day workshop in China (at HDP '06, Shanghai) | For further information: Cynthia Williams, iNEMI office: +1 207-871-1260 cell +1 207-671-7780 cwilliams@inemi.org
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