HERNDON, Virginia, U.S.A. (March 22, 2006) - Anyone interested in participating in the International Electronics Manufacturing Initiative’s (iNEMI’s) roadmap workshop has less than a week to register.  The full-day meeting, co-sponsored by Fraunhofer IZM, IEEE’s CPMT (Components, Packaging and Manufacturing Technology) Society and IMAPS Europe, is scheduled for Wednesday, 5 April, in the ICM Congress Hall at Munich Messe.  This date coincides with SEMICON Europa (3-6 April), also held at Munich Messe.

The workshop will give attendees an advance review of draft chapters of the 2007 iNEMI Roadmap, including two key market segments and eight of the nineteen technology and infrastructure areas covered:

Product Sectors
     Automotive products (Galen Reeder, Delphi)
     Consumer/portable products (Seppo Pienamaa, Nokia)

Technology Areas
     Packaging (Bill Bottoms, NanoNexus)
     Board assembly (Chuck Richardson, iNEMI)
     Organic substrates (Michael Weinhold, EIPC)
     Ceramic substrates (Paul Collander, Poltronics)
     Sensors (Tim McBride, Texas Instruments)
     Test, inspection & measurement (Michael Smith, Teradyne)
     Final assembly (Bernd Heger, Delphi)
     Environmentally conscious electronics (Nils Nissen, Fraunhofer IZM)

The workshop will also allow discussion of, and input into, the draft chapters, helping to ensure inclusion of European issues in the 2007 Roadmap.

Registration fee is $200 (U.S.), which includes a continental breakfast, lunch, social hour, and a copy of the 2007 iNEMI Roadmap CD when published in February 2007 (which sells for $250 U.S.)  Registration deadline is March 28.  For additional information about, or to register for, the iNEMI workshop, go to

http://www.inemi.org/cms/calendar/iNEMI_Roadmap_European_Workshop_Apr_2006.html

For additional information about SEMICON Europa, including free registration for the exhibition (4-6 April), go to http://www.semi.org/semiconeuropa

About the iNEMI Roadmap

Since 1994, iNEMI has mapped the future manufacturing technology needs of the global electronics industry in an effort to identify key technology and infrastructure developments needed to ensure the competitiveness of the supply chain over the next decade.  In 2004, iNEMI began proactively recruiting global participation in the roadmapping process.  The consortium is broadening international input for the 2007 Roadmap (which will be developed throughout 2006) by holding a series of regional workshops (such as this one) to review work in progress and solicit input.

The iNEMI roadmap has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies.  It helps sets priorities for research and development over the next 10 years, and is not only used by industry but also by government funding agencies and university-based research programs.  With the globalization of the iNEMI roadmap, the next "edition" should become even more important as a tool for identifying technology gaps and possible solutions for an increasingly global industry.

About iNEMI

The International Electronics Manufacturing Initiative’s mission is to assure leadership of the global electronics manufacturing supply chain.  Based in Herndon, Va. (in the Washington, DC area), the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.  The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  For additional information about iNEMI, visit www.inemi.org.

For further information:
Cynthia Williams, iNEMI
+1 (207) 871-1260
cwilliams@inemi.org