HERNDON, Virginia, U.S.A. (May 15, 2006) — The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, is planning a roadmap workshop in China, to be held in conjunction with the HDP’06 conference.  The workshop, co-sponsored by HDP’06, SMIT and IEEE CPMT Society (Components, Packaging and Manufacturing Technology), is a half-day meeting, scheduled for Tuesday, June 27, from 3:30 to 7:30 p.m. on the Yan Chang Campus of Shanghai University.

The workshop will give attendees a preview of draft chapters of the 2007 iNEMI Roadmap, including highlights of select market segments and six of the nineteen technology and infrastructure areas covered by the roadmap (semiconductors, packaging, board assembly, environmental, organic substrates and sensors).  The session will also allow discussion of, and input into, the draft chapters, helping to ensure inclusion of issues that are important to Asia-based companies.

"This is the first roadmap workshop that iNEMI has held in Asia," said Dongkai Shangguan, senior director of advanced assembly and environmental technologies for Flextronics, and chair of the iNEMI Board Assembly Technology Working Group (TWG).  "As iNEMI continues to broaden international participation in the roadmap, they are actively soliciting input through regional workshops, such as this one.  Attendees will have the advantage of getting an advance preview of select chapters, and will also have the opportunity to interact and network with key technology and business leaders from the region."

The registration fee for the workshop is:
     before May 30     250 RMB (30 USD)
     before June15     300 RMB (35 USD)
     onsite                  350 RMB (45 USD)

IEEE members get a 10% discount.  In addition, anyone registering for one of the HDP’06 short courses will receive a discount of 50 RMB.  For additional information about the 2007 Roadmap workshop, go to http://www.inemi.org/cms/calendar/iNEMI_Roadmap_Asian_Workshop_June_2006.html.  A preliminary agenda is available and will be updated as details are finalized.  Registration is being handled through HDP’06.  Go to http://www.hdp-shanghai.com/ to download a registration form.

About the iNEMI Roadmap

Since 1994, iNEMI has mapped the future manufacturing technology needs of the global electronics industry in an effort to identify key technology and infrastructure developments needed to ensure the competitiveness of the supply chain over the next decade.  In 2004, iNEMI began proactively recruiting global participation in the roadmapping process.  The consortium is broadening international input for the 2007 Roadmap (which will be developed throughout 2006) by holding a series of regional workshops to review work in progress and solicit input.

The iNEMI roadmap has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies.  It also helps sets priorities for research and development over the next 10 years, and is not only used by industry but also by government funding agencies and university-based research programs.

Roadmap efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups (TWGs). The PEGs, each chaired by a major OEM in the specific sector covered, define the future technology needs of "virtual products" from six areas: 1) portable/consumer, 2) office/large business systems, 3) automotive, 4) aerospace/defense, 5) netcom (network/datacom/telecom), and 6) medical products. Each PEG chapter forecasts future product attributes, including cost and density drivers.

The TWGs forecast trends for numerous technology and infrastructure areas, and contrast technology trends with anticipated product needs. Composed of experts from OEMs, EMS providers, suppliers, government agencies, universities and related consortia/trade associations, the TWGs predict the evolution of technology and/or business practices, identify gaps and "showstoppers" in existing technology and infrastructure, and develop recommendations for their respective areas. For more information about the 2007 iNEMI roadmap, go to:
http://www.inemi.org/cms/roadmapping/2007_iNEMI_Roadmap.html

About iNEMI
The International Electronics Manufacturing Initiative’s mission is to assure leadership of the global electronics manufacturing supply chain.  Based in Herndon, Va. (in the Washington, DC area), the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.  The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  For additional information about iNEMI, visit www.inemi.org.

For further information:
Cynthia Williams, iNEMI
+1 207-871-1260
cwilliams@inemi.org