Tuesday, February 20

iNEMI Optimizing Lead-Free Processes Forum (combined presentations)

Introduction and Agenda, Bob Pfahl, iNEMI

Pb-Free Wave Soldering Project, Denis Barbini, Vitronics Soltec; Paul Wang, Microsoft

Lead-Free Rework Optimization Project, Jasbir Bath, Solectron

Pb-Free BGAs in SnPb Assembly Project, Robert Kinyanjui, Sanmina-SCI; Quyen Chu, Jabil Circuit, Inc.

iNEMI High-Reliability RoHS Task Force Update, Mike Davisson, Agilent Technologies

Pb-free Component & Board Finish Reliability Project "Call for Participation," Richard J. Coyle, Alcatel-Lucent

Concluding Remarks, Bob Pfahl, iNEMI

iNEMI Functional Test Coverage Assessment Project Meeting

iNEMI Functional Test Coverage Assessment Project, Tony Taylor, Intel Corporation

Agilent Technologies Functional Test Coverage Model, Ryan Kinney, Agilent Technologies

Test Board, Guidant CRM, Advanced Process Development (APD)

Draft Statement of Work, Version 1.1, 2/20/07

Thursday, February 22

Keynote on 2007 Roadmap

2007 Roadmap Overview, Jim McElroy, iNEMI

Organic and Printed Electronics, Jie Zhang, Motorola

Friday, February 23

IPC-iNEMI Reliability Summit:  Keeping Industry Reliability Test Protocols Current with Rapidly Changing Markets

Agenda

IPC International Technology Roadmap, Jack Fisher, IPC

Association Activities

IPC Reliability Activities, Reza Ghaffarian, Jet Propulsion Laboratory (JPL)

iNEMI Activities, Bob Pfahl, iNEMI

HDPUG Activities, Marshall Andrews, HDPUG

GEIA Activities, Lloyd Condra, Boeing

IEC Activities, Dieter Bergman, IPC

JPCA Activities, Aki Shibata

University Activities

CALCE Activities, Michael Ostermann

OEM Activities

JCAA/JGPP Lead-Free Testing for High Performance Applications:  Data Utilization & NASA Phase II Programs, Dave Hillman, Rockwell Collins & The JCAA/JGPP/NASA Team

JCAA/JG-PP Lead-Free Solder Project, Tom Woodrow, Boeing Phantom Works

Sun Microsystems, Mike Freda, Sun Microsystems; Karl Sauter, Sun Microsystems

Correlation of Material Properties to the Reliability Performance of High Density BGA Package Solder Joints, Vasu Vasudevan, Intel Corporation

Discussion