Newsroom
April 1
iNEMI Board and Systems Manufacturing Test TIG
TIG and Project Reports
TIG Overview Boundary Scan Adoption Project Board Flexure Standardization Project Functional Test Coverage Assessment Project
Test, Inspection & Measurement TWG Report
APEX Free Forum F01 — iNEMI Lead-Free Forum
Agenda, Bob Pfahl, iNEMI
Pb-Free Wave Soldering Project, Denis Barbini, Vitronics Soltec
Lead-Free Rework Optimization Project, Jasbir Bath, Flextronics
Pb-Free BGAs in SnPb Assembly Project, Robert Kinyanjui, Sanmina-SCI; Quyen Chu, Jabil Circuit, Inc.
Closing Remarks, Bob Pfahl, iNEMI
APEX Session S08 — Repair and Rework
Paper: "iNEMI Rework Machine Temperature Tolerance and Repeatability Study," Jasbir Bath (Flextronics International), Chris Underhill (Finetech USA), Jochen Schreck (ERSA GmbH), Paul Wood and Grant Miller (O.K. Industries), Doug Peck (VJ Electronixs)
April 2
APEX Session S15 — Backward Compatibility: Where Leaded and Lead Free Collide
Paper: "Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in SnPb Assembly Process," Robert Kinyanjui, Ph.D. (Sanmina-SCI Corporation), Quyen Chu (Jabil), Polina Snugovsky, Ph.D. (Celestica, Inc.), Richard Coyle, Ph.D. (Alcatel-Lucent)
iNEMI Halogen-Free Follow-On Project Meeting
April 3
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