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IPC Printed Circuits Expo/APEX/Designers Summit 2008
March 31 - April 3, 2008
Las Vegas, Nevada

April 1

iNEMI Board and Systems Manufacturing Test TIG

TIG and Project Reports

TIG Overview
Boundary Scan Adoption Project
Board Flexure Standardization Project
Functional Test Coverage Assessment Project

Test, Inspection & Measurement TWG Report

APEX Free Forum F01 — iNEMI Lead-Free Forum

Agenda, Bob Pfahl, iNEMI

Pb-Free Wave Soldering Project, Denis Barbini, Vitronics Soltec

Lead-Free Rework Optimization Project, Jasbir Bath, Flextronics

Pb-Free BGAs in SnPb Assembly Project, Robert Kinyanjui, Sanmina-SCI; Quyen Chu, Jabil Circuit, Inc.

Closing Remarks, Bob Pfahl, iNEMI

APEX Session S08 — Repair and Rework

Paper:  "iNEMI Rework Machine Temperature Tolerance and Repeatability Study," Jasbir Bath (Flextronics International), Chris Underhill (Finetech USA), Jochen Schreck (ERSA GmbH), Paul Wood and Grant Miller (O.K. Industries), Doug Peck (VJ Electronixs)

April 2

APEX Session S15 — Backward Compatibility:  Where Leaded and Lead Free Collide

Paper:  "Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in SnPb Assembly Process," Robert Kinyanjui, Ph.D. (Sanmina-SCI Corporation), Quyen Chu (Jabil), Polina Snugovsky, Ph.D. (Celestica, Inc.), Richard Coyle, Ph.D. (Alcatel-Lucent)

iNEMI Halogen-Free Follow-On Project Meeting

April 3