Newsroom
March 31
APEX Free Forum FF02 — iNEMI Technology Roadmap
iNEMI Technology Roadmap Keynote, Jim McElroy (iNEMI)
2009 Environmentally Conscious Electronics Roadmap - Future Initiatives for Sustainability, Scott O'Connell (Dell, Inc.)
2009 Board Assembly Roadmap, Chuck Richardson (iNEMI)
Emerging Energy Efficient Technologies - Solid State Illumination & Photovoltaics, Bob Pfahl (iNEMI)
PVC Alternatives Initiative
Agenda and Overview, Scott O'Connell (Dell)
Goals and Scope, Scott O'Connell (Dell)
Eco-Impact Evaluator for ICT Equipment Initiative
Agenda and Overview, Tom Okrasinski (Alcatel-Lucent), Todd Myers (Cisco)
SOW Development, Tom Okrasinski (Alcatel-Lucent), Todd Myers (Cisco)
April 1
HFR-Free Leadership Program Meeting, Bob Pfahl (iNEMI), Stephen Tisdale (Intel Corporation)
- PCB Material, John Davignon (Intel Corporation)
- Signal Integrity, Stephen Hall (Intel Corporation)
April 2
APEX Free Forum FF06 — iNEMI Pb-Free Forum
Agenda and Introduction, Chuck Richardson (iNEMI)
Pb-Free Alloy Alternatives Project, Greg Henshall (HP)
Pb-Free Wave Soldering Project, Denis Barbini (Vitronics Soltec)
Lead-Free Rework Optimization Project, Jasbir Bath (iNEMI)
BFR-Free High Reliability Project, Stephen Tisdale (Intel Corporation)
HFR-Free Technology Leadership Projects, Stephen Tisdale (Intel Corporation)
April 3
iNEMI TIG Presentations
The following are summaries from the various TIG meetings that took place March 30 and April 1. These presentations were given to the iNEMI Technical Committee Meeting
Introduction - 2009 Technology Plan Reviews, Chuck Richardson (iNEMI)
Board Assembly TIG, Ian Williams (Intel Corporation)
Board and Systems Manufacturing Test TIG, Rosa Reinosa (Hewlett-Packard Company)
Environmentally Conscious Electronics TIG, Scott O'Connell (Dell)
Medical TIG, Anthony Primavera (Micro Systems Engineering, Inc.)
Optoelectronics TIG, Brian Roche (Cisco Systems, Inc.)
Organic Packaging Substrates TIG, Hamid Azimi (Intel Corporation)
Organic PCB TIG, John Davignon (Intel Corporation)
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