May 15 - iNEMI Roadmap

Overview and Highlights of the 2007 iNEMI Roadmap, Jim McElroy, iNEMI

Organic Interconnect Substrates Roadmap, Jack Fisher, Interconnect Technology Analysis

Connectors Roadmap, John MacWilliams, Bishop & Associates
     Part 1 (photos)
     Part 2
     Part 3

Board Assembly Roadmap, Joe Belmonte, Speedline Technologies

iNEMI Pb-Free BGAs in SnPb Assemblies Project, presented by Jim McElroy, iNEMI

History of Celestica Participation in iNEMI, Peter Tomaiuolo, Celestica

Packaging Roadmap, Dr. Robert C. Pfahl, iNEMI

iNEMI Nano-Attach Project, Dr. Chik Hope, Motorola

IPC Roadmap, Jack Fisher, Interconnect Technology Analysis

iNEMI Fiber Connector End-Face Inspection Project, Dr. Tatiana Berdinskikh, Celestica

Environmentally Conscious Electronics Roadmap, Dr. Robert C. Pfahl, iNEMI

May 16 - The Impact of Environmental Legislation

Continuous Compliance:  Global Environmental Legislation, Marjory Craw-Ivanco, Celestica

Technical Papers

Mixing Metallurgy:  Reliability of SAC Balled Area Array Packages Assembled Using SnPb Solder, Heather McCormick, Celestica (Best International Paper, SMTAI 2006)

Low Melting Alloys in Pb-Free Assembly Rework, Dr. Polina Snugovsky, Celestica (Best International Paper, APEX 2007)

Effects of SAC Alloy Copper Dissolution on PTH Processes:  Cost and Performance Justify Use of Certain Alternatives to SAC305/405, Craig Hamilton, Celestica (originally presented at Pan Pac International 2007)

Cradle to Re-Birth:  The Future of the Electronics Industry, David Jollimore, Celestica