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Presentations from the Symposium on Environmentally Friendly Materials are for sale
on CD-ROM for 75 USD. Presentations and speakers are listed below.
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Day 1第一天
KEYNOTE: Environmental Excellence: A Call to Action (English only)
Robin Martin, Intel
主题演讲：环境卓越行动起来
iNEMI BFR-Free PCB Material Evaluation Project
Gary Long, Intel
iNEMI项目报告：无溴化阻燃剂线路板材料的评估
HDP User Group (HDPUG) Halogen-Free Activities
Jay Huang, Wistron
HDPUG的无卤活动
US EPA Flame Retardants in Printed Circuit Boards Partnership
Melanie Vrabel, US EPA
美国环境保护属印刷线路板阻燃剂项目
Halogen-Free: What is it and How Did We Get Here?
Leesha Peng Lixia, IPC China
什么是无卤素怎样实现无卤素
Dell Position on BFR/CFR/PVC “Halogen-Free“
Frank Shou, Dell
戴尔公司的无卤化的立场（BFR/CFR/PVC的替代）
The Lenovo Journey to Low Halogen (English only)
Hongzhi Tao, Lenovo
联想的低卤化历程
Strategic Cooperation to Improve the Environment
Haley Fu, iNEMI
改善环境需要战略合作
Foxconn Supplier Halogen-Free Management Overview
K.T. Yeh, Foxconn
富士康供应商无卤管理概况
Wistron’s Halogen-Free Roadmap and Strategies for Implementation
Jay Huang, Wistron
纬创无卤产品规划和执行策略
Quanta's Halogen-Free Readiness and Initiatives
Angie Yu, Quanta
广达推动无卤素的做法
Halogen Free Materials Expectations (English only)
Terrance Richesin, Intel
对无卤素材料之期望
Day 2第二天
KEYNOTE : Halogen Free Laminates A Market Update, Key Properties and PCB Processability (English only)
Joshua Chiang, Nan Ya CCL
主题演讲：无卤材料----对制造和供应链的挑战
A Novel Halogen-Free Material with Low Thermal Expansion for Advanced Packaging Substrates
Minsu (Tim) Lee, Doosan
使用于先进封装基材的低热膨胀系数无卤素新材料
Hitachi Halogen-Free Materials for Advanced Substrates & Printed Circuit Boards
Tetsuro Irino, Hitachi Chemical
高性能基板和印制板用Hitachi无卤材料
Intel Halogen-Free Component Key Properties and Reliability Test Results
Hamid Azimi, Intel
英特尔无卤器件的关键性能和可靠性试验结果
Halogen Free: A PWB Fabricator's Perspective
Darren Hitchcock, Marie Yu, Multek
无卤素：线路板制造商的观点
Halogen-Free in PCBs — Use, Anticipation, and Exploitation
Brian Nelson, Sanmina-SCI
无卤素在印刷线路板领域----应用、参与和开发
Intel Halogen-Free PCB Material Evaluations and Board-Level Reliability (English only)
Gary Long, Ife Hsu, Intel
英特尔无卤线路板材料的评估和板级的可靠性
Impact of Halogen-Free on Connectors
David Bender, Tyco Electronics
无卤化对连接器的影响
Design for Low-Halogen Green Electronics
Tamim P. Sidiki, DSM Engineering Plastics
低卤绿色电子产品设计
Halogen-Free – without Constraints
Jacobs Alexandra, Ticona
无卤阻燃无限空间
Next Generation Research & Challenges for Eco-friendly Soldering (English only)
Masato Shimamura, Senju
下一代环保焊接的研发和挑战
Global Halogen-Free Requirements, Progress and Solutions
Sean Li, SGS-CSTC
全球无卤化要求、进展及应对