Newsroom
Introduction, Agenda, iNEMI Overview; Michael K. Patterson, Intel Corporation; David Godlewski, iNEMI
Test Data on Copper Micro-Channel Heat Sinks, Ralph Webb and Hasan Nasir, Omega Piezo Technologies, Inc.
An Integrated Cost-Effective Liquid Cooling Technology for CPU Cooling, Ketan R. Shah, Platform Systems Technology Group (PST)
Cold Plate Manufacturing - Factors that Drive Up Production Pricing, Kathryn Whitenack, Lytron, Inc.
Passive Two-Phase Liquid Cooling as an Alternative to Aqueous Forced Convection, Phillip E. Tuma, 3M Electronics Markets Materials Division
Integrated Liquid Cooled Heatsink, Gregg Kloeppel and Jeff Stein, Artech
Cost-Effective Design and Manufacture of Liquid Cooling Systems, Craig Johnston, Thermaltake Technology Co., Ltd.