Newsroom
September 26-30, 2004
Donald Stephens Convention Center
Chicago, Illinois
Closing Identified Technology Gaps: NEMI Projects to Eliminate PB Solder, Chuck Richardson, NEMI.
Lead-Free and Tin-Lead Rework Development Activities within the NEMI Lead-Free Assembly and Rework Project, Jasbir Bath and Mike Wageman, Solectron Corporation; Quyen Chu and Nabel Ghalib, Jabil Circuits; Alan Donaldson, Intel Corp.; Jose Matias and Eddie Hernandez, Hewlett-Packard Corp.
A History of Tin Whisker Theory: 1946 to 2004, George T. Galyon, IBM eSG Group.
Selective Soldering with SN3.9AG0.6CU: Process Development, Ursula G. Marquez and Denis C. Barbini, Vitronics Soltec, Inc.; Richard A. Szymanowski, Celestica, Inc.
RoHS/WEEE Electronics Manufacturing Overview of Development, and Implementation, Chuck Richardson, presented as part of the Technology Forecaster’s "Quarterly Forum" held during SMTAI, September 30, 2004, Chicago.