NOTE: All presentations and papers are downloadable PDFs
Roadmap Presentation (August 19, 2008)
2007 Roadmap - Process, Trends and Results/2009 Roadmap Preview, Chuck Richardson (iNEMI)
Pb-Free Alloy Alternatives (August 21, 2008)
Presentation: iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry, Greg Henshall (Hewlett-Packard) Paper: iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry, Greg Henshall (Hewlett-Packard); Robert Healey and Ranjit S. Pandher (Cookson Electronics); Keith Sweatman and Keith Howell (Nihon Superior Co., Ltd); Richard Coyle (Alcatel-Lucent); Thilo Sack and Polina Snugovsky (Celestica, Inc.); Stephen Tisdale and Fay Hua (Intel Corporation)
Presentation: iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry, Greg Henshall (Hewlett-Packard)
Paper: iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry, Greg Henshall (Hewlett-Packard); Robert Healey and Ranjit S. Pandher (Cookson Electronics); Keith Sweatman and Keith Howell (Nihon Superior Co., Ltd); Richard Coyle (Alcatel-Lucent); Thilo Sack and Polina Snugovsky (Celestica, Inc.); Stephen Tisdale and Fay Hua (Intel Corporation)
iNEMI BFR-Free PCB Material Evaluation Project (August 21, 2008)
Presentation: iNEMI BFR-Free PCB Material Evaluation Project, Stephen Tisdale (Intel Corporation) Paper: iNEMI BFR-Free PCB Materials Evaluation Project Report, Stephen Tisdale/Gary B. Long (Intel Corporation), Roger Krabbenhoft (IBM Corporation), Kostas Papathomas (Endicott Interconnect), Terry Fischer (Hitachi Chemical)
Presentation: iNEMI BFR-Free PCB Material Evaluation Project, Stephen Tisdale (Intel Corporation)
Paper: iNEMI BFR-Free PCB Materials Evaluation Project Report, Stephen Tisdale/Gary B. Long (Intel Corporation), Roger Krabbenhoft (IBM Corporation), Kostas Papathomas (Endicott Interconnect), Terry Fischer (Hitachi Chemical)