Development of Baseline Lead-free Rework and Assembly Processes for Large Printed Circuit Assemblies, Patrick Roubaud (HP), Jerry Gleason (HP), Charlie Reynolds (IBM), Ken Lyjak (IBM), Matt Kelly (Celestica), Jasbir Bath (Solectron)

NEMI Tin Whisker Projects, Ron Gedney (NEMI), Joe Smetana (Alcatel), Nhat Vo (Freescale Semiconductor, Inc.), George Galyon (IBM).

The Transition to Pb-free Products, Galen J. Reeder (Delphi Corporation), Dave McCarron (Dell), Robert C. Pfahl, Jr. (NEMI)