Newsroom
iNEMI Introduction/Overview, David Godlewski, iNEMI
iNEMI Fiber Connector End-Face Inspection Project
Chair: Tatiana Berdinskikh, Celestica
9 a.m.—noon
Fiber Connector End-Face Inspection Specifications (background & overview), Tatiana Berdinskikh, Celestica.
Development of Cleanliness Specification for Single-Mode Connectors, Tatiana Berdinskikh, Celestica (originally presented at APEX conference, February 22, 2005; Anaheim, CA).
Contamination’s Influence on Receptacle-type Optical Data Link (the dust on endface experiment for receptacle devices), Yutaka Sadohara, Sumitomo Electric Industries, Ltd.
iNEMI Fiber Optic Splice Loss Measurement Project
Chair: Peter Arrowsmith, Celestica
1:00-2:00 p.m.
FOTP-XX Fiber Optic Splice Loss Measurement Methods (Draft 6), Peter Arrowsmith, Celestica.
iNEMI Optoelectronics for Substrates Project
Chair: Peter Arrowsmith, Celestica
2:00-3:00 p.m.
What is a Backplane? (2005 iNEMI Back Substrate Implementation Plan), Jack Fisher, Interconnect Technology Analysis, Inc., iNEMI consultant].
Printed Circuit Board Architecture for the use of Optical Interconnection of Components, James Howard, WUS Printed Circuits.
iNEMI Optoelectronic TIG Gap Analysis Meeting
Chair: Peter Arrowsmith, Celestica
3:00-5:00 p.m.
Optoelectronics TIG Gap Analysis Meeting, Peter Arrowsmith, Celestica.