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iNEMI Optoelectronics TIG Meetings
OFC/NFOEC 2005
March 7, 2005
Anaheim, California


iNEMI Introduction/Overview, David Godlewski, iNEMI

iNEMI Fiber Connector End-Face Inspection Project
Chair: Tatiana Berdinskikh, Celestica
9 a.m.—noon

Fiber Connector End-Face Inspection Specifications (background & overview), Tatiana Berdinskikh, Celestica.   

Development of Cleanliness Specification for Single-Mode Connectors, Tatiana Berdinskikh, Celestica (originally presented at APEX conference, February 22, 2005; Anaheim, CA). 

Contamination’s Influence on Receptacle-type Optical Data Link (the dust on endface experiment for receptacle devices), Yutaka Sadohara, Sumitomo Electric Industries, Ltd.


iNEMI Fiber Optic Splice Loss Measurement Project
Chair: Peter Arrowsmith, Celestica
1:00-2:00 p.m. 

FOTP-XX  Fiber Optic Splice Loss Measurement Methods (Draft 6), Peter Arrowsmith, Celestica.  


iNEMI Optoelectronics for Substrates Project
Chair: Peter Arrowsmith, Celestica
2:00-3:00 p.m.

What is a Backplane? (2005 iNEMI Back Substrate Implementation Plan), Jack Fisher, Interconnect Technology Analysis, Inc., iNEMI consultant]. 

Printed Circuit Board Architecture for the use of Optical Interconnection of Components, James Howard, WUS Printed Circuits.  


iNEMI Optoelectronic TIG Gap Analysis Meeting
Chair: Peter Arrowsmith, Celestica
3:00-5:00 p.m.

Optoelectronics TIG Gap Analysis Meeting, Peter Arrowsmith, Celestica.