Newsroom
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Applications
Presentations: iNEMI RFID Forum, hosted by Sun Microsystems (October 4, 2005; Newark, CA)
Recommendations to Electronics Industry Component Supply Base (iNEMI High-Reliability RoHS Task Force; 8/19/05)
Components
Presentations: iNEMI SMT Reel Labeling Project Workshop (April 27, 2005; Fort Worth, TX)
NEMI DPMO Project Forum - APEX 2004
"The NEMI Roadmap: Integrated Passives Technology and Economics," Joe Dougherty, Penn State, et al, Capacitor and Resistor Technology Symposium (CARTS), March 31-April 3, 2003, Scottsdale, AZ.
"NEMI Infrastructure: Roadmapping Industry Needs and Closing Technology Gaps," Bob Pfahl, NEMI, NCMS Embedded Passives Seminar, January 30, 2003, Austin, TX.
General
Leadership through Innovation: Developing a Strategic Vision of the Research Priorities for the Electronics Industry, Robert C. Pfahl (NEMI), NEMI presentation to the National Science and Technology Council (NSTC), Committee on Technology, Subcommittee on Nanoscale Science, Engineering and Technology (NSET), November 2, 2004 (Arlington, VA).
Drivers for Globalizing R&D, Bob Pfah (NEMI), Committee on Globalization of Materials Research and Development, National Materials Advisory Board of the National Academies, January 26, 2004 (Washington, D.C).
Manufacturing Test Strategy Cost Model, Rosa D. Reinosa and Carlos Michel, Hewlett-Packard Company, International Test Conference (ITC), Board Test Workshop, October 3, 2003 (Charlotte, NC). paper presentation
NEMI Test Strategy Project Forum (APEX 2003)
Panel: "North American Manufacturing: What will the Future Bring?" Jim McElroy, NEMI, IPC Annual meeting - SMEMA Council, November 4, 2002, New Orleans.
Doing Business in China - "Electronics Manufacturing Migration," Jim McElroy, Semiconductor Assembly Council (SAC), September 13, 2002, Sunnyvale, CA.
Industry/Academia Collaboration for Manufacturing R&D (APEX 2001)
Lead-Free and Environmental
iNEMI Lead-Free Forum, IPC Printed Circuits Expo/APEX/Designers Summit 2008, April 1, 2008 (Las Vegas, Nevada)
Lead-Free Wave Soldering, presented by Denis Barbini (Vitronics Soltec) at Productronica 2007; November 14, 2007; Munich, Germany
iNEMI China and the Green Electronics Roadmap, Sino-European Workshop on Green Electronics Technology (June 26; Shanghai, China)
Environmental Regulations and Materials Technology in the Electronics Industry, Robert C. Pfahl, 2007 MRS Spring Meeting (4/11/07; San Francisco, CA)
PRESENTATIONS: Availability of SnPb-Compatible BGAs Workshop, hosted by HP (3/1/07)
Lead-Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards, presented by Denis Barbini (Vitronics Soltec) on behalf of the iNEMI Pb-Free Wave Soldering Project team, 11th Annual SMTA Pan Pacific Microelectronics Symposium & Exhibition, January 31, 2007, Maui, Hawaii. (paper)
Optimizing Lead-Free Processes Forum, IPC Printed Circuits Expo/APEX/Designers Summit 2006, February 8, 2006 (Los Angeles, CA).
Beyond RoHS: Efforts to Strengthen the Electronics Manufacturing Supply Chain, Robert C. Pfahl, Jr., iNEMI; Joe Johnson, Cisco Systems, Inc., presented at CARE Innovation 2006, November 13, 2006, (Vienna, Austria) presentation paper
PRESENTATIONS: Life after EU RoHS Forum (co-sponsored by IPC), (September 28, 2006; Rosemont, IL)
PRESENTATIONS: Availability of SnPb BGAs Workshop (September 28, 2006; Rosemont, IL)
iNEMI and TechSearch International Panel on Lead-Free Issues at SEMICON WEST, July 2006 (San Francisco, CA)
Environmentally Conscious Products & Processes in Electronics: Past, Present & Future, Bob Pfahl (iNEMI), NSF's Environmentally Benign Design & Manufacture Workshop, June 27, 2006 (Ballston, VA)
iNEMI Collaboration: Pb-Free and RoHS Transition, R. C. Pfahl, Jr., and J. B. McElroy, Sr. (iNEMI), presented by Jim Liu (Motorola), NEPCON China/EMT China 2006, April 4-7, 2006, Shanghai. paper presentation
iNEMI Pb-Free and RoHS Update, IPC Printed Circuits Expo/APEX/Designers Summit 2006, February 8, 2006 (Anaheim, CA).
Environmentally Preferred Electronic Products for the Global Market, Robert Pfahl (iNEMI), RECCON '05 Conference: Global Electronics Recycling Solutions, November 29, 2005, Morgantown, West Virginia
Industry Gets Ready for RoHS, Roger Han (Vitronics Soltec), International Lead-Free Manufacturing Technology Seminar 2005, October 14, 2005, Shenzhen, China
iNEMI Lead-Free Micro BGA, CBGA, Mictor Connector and Through-Hole PDIP Rework Evaluations, Jasbir Bath (Solectron), Quyen Chu and Nabel Ghalib (Jabil Circuit), Charlie Han and Greg Smith (LACE Technologies), SMTA International, September 28, 2005 paper presentation
Pb-free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies, Jerry Gleason (HP), Charlie Reynolds (IBM), Jasbir Bath (Solectron Corporation), Quyen Chu (Jabil Circuit), Matthew Kelly (formerly Celestica, now at IBM), Ken Lyjak (IBM) and Patrick Roubaud (HP), IEEE ECTC, May 31-June 3 (Lake Buena Vista, FL).
Results from the 2004 iNEMI Environmentally Conscious Electronics (ECE) Roadmap, Mark Newton (Dell), Joe Johnson (Microsoft) and Robert C. Pfahl Jr. (iNEMI), 2005 IEEE International Symposium on Electronics & the Environment (ISEE) and Electronics Recycling SUMMIT, May 17, 2005 (New Orleans, LA) paper presentation
Transition to Pb-Free Products, Dr. Ning-Cheng Lee (Indium Corporation), NEPCON China/EMT China 2005, April 12-15, Shanghai, China (this presentation was also given at NEPCON South China, August 30-September 2, Shenzhen)
R&D Requirements from the 2004 iNEMI Roadmap, Robert Pfahl (iNEMI), Fraunhofer IZM Day, April 7, 2005, Tokyo, Japan
Presentations: NEMI RoHS/Pb-Free Summit (October 18-20, 2004; Louisville, CO)
Selective Soldering with SN3.9AG0.6CU: Process Development, Ursula G. Marquez and Denis C. Barbini, Vitronics Soltec, Inc.; Richard A. Szymanowski, Celestica, Inc., SMTAI International conference, September 26-30, 2004 (Chicago, IL).
Lead-Free and Tin-Lead Rework Development Activities within the NEMI Lead-Free Assembly and Rework Project, Jasbir Bath and Mike Wageman, Solectron Corporation; Quyen Chu and Nabel Ghalib, Jabil Circuits; Alan Donaldson, Intel Corp.; Jose Matias and Eddie Hernandez, Hewlett-Packard Corp., SMTAI International conference, September 26-30, 2004 (Chicago, IL).
Closing Identified Technology Gaps: NEMI Projects to Eliminate PB Solder, Chuck Richardson, NEMI, SMTAI International conference, September 26-30, 2004 (Chicago, IL).
NEMI Lead-Free Solder Efforts, Mark Kwoka, Intersil Corp., NASA AP2 International Pollution Prevention Workshop, September 22, 2004 (Cocoa Beach, FL).
Presentations: NEMI Material Data Exchange Coordination Meeting, Berlin, Germany (September 9, 2004)
NEMI Activities to Strengthen the Electronics Manufacturing Supply Chain: The Transition to Pb-free Products, Dr. Robert C. Pfahl, Jr., Electronics Goes Green 2004+, September 6-8, 2004 (Berlin, Germany).
Material Declaration Data Exchange Workshop (August 30-31, 2004; Santa Clara, CA)
NEMI presentations - Second International Conference on Lead Free Electronics, June 21-23, 2004 (Amsterdam).
Closing Identified Technology Gaps: NEMI Projects to Eliminate Pb Solder, Chuck Richardson, CARTS 2004, March 29 (San Antonio, TX).
NEMI Lead-Free Rework Development (Phase 3), Jasbir Bath (Solectron Corporation), 5th IPC/JEDEC International Lead Free Conference, March 17-19, 2004 (San Jose, CA).
Status of Pb-Free Activities in the North American Supply Chain, Galen Reeder, Rick Charbonneau, Bob Pfahl and Carol Handwerker (presented by Carol Handwerker), IPC/JEDEC 4th International Conference on Lead-Free Electronic Components & Assemblies, October 21-22, 2003 (Frankfurt, Germany).
NEMI Pb-Free Solder Projects: Progress and Results, Carol Handwerker, NIST, IPC/JEDEC 4th International Conference on Lead-Free Electronic Components & Assemblies, October 21-22, 2003 (Frankfurt, Germany).
"Environmental Programs and Strategies in the North American Electronics Sector: Addressing Global Expectations," Robert Pfahl, NEMI, SMTA Great Lakes Chapter, October 16, 2003.
"Pb-Free Electronics: Overview of the Drivers, R&D, and Status of Implementation," Dr. Robert Pfahl, NEMI, EOEM Design Expo online conference, October 8-9, 2003.
NEMI Lead-Free Assembly Project: Comparison between PbSn and SnAgCu Reliability and Microstructures, Carol Handwerker, NIST, et al, proceedings of the SMTA International conference, September 21-25, 2003 (Rosemont, IL), pp. 664-669. paper presentation
"Pb-Free Electronics: Drivers, R&D and Transition," Dr. Robert Pfahl, NEMI, Supply Network Conference, September 18, 2003, San Jose, CA.
Lead-free Solder Assembly: Impact and Opportunity, Edwin Bradley, Motorola, Electronic Components and Technology Conference (ECTC), May 27-30, 2003 (New Orleans, LA).
"NEMI Environmental Programs," Dr. Robert C. Pfahl, NEMI, presented at the Electronics Recycling Summit, IEEE International Symposium on Electronics and the Environment, May 22, 2003, Boston.
"Environmental Programs and Strategies in the North American Electronics Sector: Addressing Global Expectations" a presentation by Robert Pfahl to the Western Pennsylvania chapter of SMTA, May 9, 2003.
"Status of Pb-Free Activities in the North American Supply Chain," Robert C. Pfahl Jr., NEMI, Electronics Industries Association spring conference, May 6, 2003, Washington, D.C.
"Environmental Programs and Strategies in the North American Electronics Sector," Robert C. Pfahl Jr, keynote presentation at the Going Green-CARE INNOVATION 2002 Conference, November 25, 2002, Vienna, Austria.
"Status of Pb-Free Activities in North America," Robert C Pfahl Jr, Going Green-CARE INNOVATION 2002 Conference, November 26, 2002, Vienna, Austria.
"Roadmap of Lead-Free Assembly in North America," Jim Arnold, Motorola, JISSO/PROTEC Forum 2002 and Second Lead-Free World Summit, November 19-20, 2002; Tokyo, Japan. (paper) and (presentation)
NEMI Take-Back & Recycling Forum (October 10-11, 2002)
NEMI Lead-Free Project Report (APEX 2002)
Workshop on Modeling and Data Needs for Lead-Free Solders, February 15, 2001 (New Orleans, LA)
Lead-Free Forum (APEX 2001)
NEMI Recycling Forum (September 13, 2000; Binghamton NY)
Lead-Free Project Status Report, Ron Gedney, NEMI, September 2000.
"Lead-Free Assembly Drivers," Edwin Bradley, Motorola, IPCWorks, October 1999.
"Alternative Metallic Finishes for PWB," Bruce Houghton, Celestica, IPC Expo, 1997.
Tin Whiskers
Current Investigation of iNEMI’s Tin Whisker Committee, Peng Su (Cisco Systems, Inc.), 2nd International Tin Whisker Symposium, April 25, 2008, Tokyo, Japan.
A presentation from the iNEMI Accelerated Tin Whisker Test Committee is now available for free download. The title of this presentation is: "The Effect of Temperature and Humidity Variations on Whisker Growth: Results of iNEMI Environmental Testing." A CD of the iNEMI tin whisker presentations made at ECTC 2007 is available for $75.00 at this link.
PRESENTATIONS: iNEMI Tin Whisker Workshop at ECTC, May 29, 2007; Reno, Nevada
PRESENTATIONS: iNEMI Tin Whisker Workshop at ECTC, May 30, 2006; San Diego, CA
PRESENTATIONS: iNEMI Tin Whisker Workshop at ECTC, May 31, 2005; Lake Buena Vista, FL
The Integrated Theory of Whisker Formation: A Stress Analysis, G. T. Galyon (IBM eSystems Group), C. Xu (Cookson Electronics), S. Lal (FCI USA), B. Notohardjono (IBM eSystems Group) and L. Palmer (IBM eSystems Group), IEEE ECTC, May 31-June 3 (Lake Buena Vista, FL).
NEMI Sn Whisker Project Status, Maureen Williams, NIST, JISSO/PROTEC Forum 2004, October 8, 2004 (Japan).
NEMI Sn Whisker Project Status, Maureen Williams, 2nd Whisker Joint Meeting 2004, October 7, 2004 (Japan).
A History of Tin Whisker Theory: 1946 to 2004, George T. Galyon, IBM eSG Group., SMTAI International conference, September 26-30, 2004 (Chicago, IL).
Test Method for Evaluating Tin Whisker Growth on Plated Surfaces (Revision 6.1; 06/17/04)
Annotated Tin Whisker Bibliography and Anthology, Dr. George T. Galyon, IBM; (updated November 2003, v1.2)
Tin Whisker Modeling Project � Interim Report (July 2003)
"NEMI Sn Whisker Project," Irina Boguslavsky, NEMI consultant; Peter Bush, SUNY Buffalo; Elsa Kam-Lum, Allegro MicroSystems; Mark Kwoka, Intersil; Jack McCullen, Intel; Nick Vo, Motorola; Tin Whisker Joint Meeting: NEMI, JEITA & ITRI, May 15, 2003, Tokyo, Japan.
(paper) and (presentation)
"Recrystallization Principles Applied to Whisker Growth in Tin," Dr. Irina Boguslavsky, NEMI consultant, and Peter Bush, SUNY Buffalo, APEX conference, March 31, 2003, Anaheim, California.
NEMI/NIST/TMS Workshop on Tin Whiskers (March 2, 2003; San Diego, CA)
NEMI Tin Whiskers Workshop (held at the IPC annual meeting, November 7, 2002)
"Understanding Whisker Phenomenon: Driving Force for Whisker Formation," Chen Xu, Yun Zhang, C. Fan and J. Abys, Cookson Electronics, presented at a CALCE meeting, University of Maryland, fall of 2002.
"Whiskers: Truth and Mystery," Irina Boguslavsky, NEMI consultant, NEMI/IPC Lead-Free Symposium, September 19, 2002, Montreal, Canada.
Tin Whiskers Forum (APEX 2002)
Optoelectronics
iNEMI Meeting Presentations: Fiber Connector End-Face Inspection Project and Optoelectronics TIG Meeting, March 26, 2007 (held in conjunction with OFC/NFOEC 2007), Anaheim, CA
Accumulation of Particles Near the Core During Repetitive Fiber Connector Matings and De-Matings, presented by Tatiana Berdinskikh (Celestica) on behalf of the Fiber Connector End-Face Inspection Project Team, OFC/NFOEC, March 29, 2007, Anaheim, CA
Development of Cleanliness Specification for Single-Mode Connectors with 1.25 and 2.5 mm Ferrules, iNEMI Fiber Optic End-Face Inspection Project, Tatiana Berdinskikh (Celestica), Sun-Yuan Huang (Intel), Mike Hughes (US Conec), Heather Tkalec (Alcatel) and Doug Wilson (PVI Systems), IEC meeting, Quebec City, October 16, 2006
Roadmap for Optical Backplanes: A Copper vs Opto Business Analysis, Jack Fisher (Interconnect Technology Analysis), HSD Workshop on Interconnections within High Speed Digital Systems, sponsored by IEEE Laser & Electro-Optics Society (LEOS), May 14-17, 2006 (Santa Fe, NM). A shortened version of this information was also presented at the 7th Jisso International Council Meeting, May 22-24, 2006 (Berlin, Germany).
Presentation (PDF)
Waveguide comparison (PDF)
Reliability & performance tables (PDF)
iNEMI Optoeletronics Roadmap for 2004, presented by Laura Turbini (CMAP) and John Stafford (JWS Consulting), SMTA International, September 26, 2005 paper presentation
iNEMI Optoelectronics TIG Meetings (held at OFC/NFOEC 2005, March 7, 2005, Anaheim, CA).
NEMI Project on Cost-Performance Modeling of High Speed Backplanes, Copper vs. Optical, presented by Peter Arrowsmith, 15th Annual Workshop on Interconnections within High-Speed Digital Systems, IEEE Lasers and Electro-Optics Society, May 2-5, 2004 (Santa Fe NM).
Optical Connector Contamination and its Influence on Optical Signal Performance, presented by Randy Manning, Tyco Electronics, IEC SC86B/WG6, April, 2004 (Warsaw, Poland).
Degradation of Optical Performance of Fiber Optic Connectors in a Manufacturing Environment (poster session presented by Tatiana Berdinskikh, Celestica, at APEX 2004 February 26, 2004)
Is that Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement, NEMI Fiber Optic Splice Improvement Project, Peter Arrowsmith, Celestica, APEX 2004, February 26, 2004 (Anaheim, CA). paper presentation
NEMI Cost Analysis: Optical vs. Copper Backplanes (Part 1: Benchmarking Copper), presented by Adam Singer, Cookson Electronics, for Jack Fisher, APEX 2004, February 26, 2004 (Anaheim, CA).
Optical Connector Contamination and its Influence on Optical Signal Peformance, Tatiana Berdinskikh, Celestical International, et al, International Electrotechnical Commission (IEC) working group technical sessions, October 7, 2003 (Montreal).
Improving Fiber Optic Splice Loss, presented by Peter Arrowsmith, Celestica, and Denis Gignac, Nortel Networks, International Electrotechnical Commission (IEC) working group technical sessions, October 7, 2003 (Montreal).
"NEMI Optoelectronics Industry Initiatives," David Godlewski, NEMI, Strategies In Optoelectronics Manufacturing Conference, April 15-16, 2003, San Mateo, CA.
Optoelectronics Microsystems International (OMI) Conference 2003 (Ottawa, Canada, April 28-May 1, 2003)
Panel: "Optoelectronics - Mainstream or Tributary? (NEMI's Optoelectronics Initiatives)," Alan Rae, Cookson Electronics, Fiberoptic Automation Conference (co-located with NEPCON West and Assembly West), December 4-6, 2002, San Jose, CA.
"A Preview of the National Electronics Manufacturing Initiative's (NEMI's) Year 2002 Optoelectronics Roadmap," John W. Stafford, consultant, Electronics Packaging Symposium - Optoelectronics: Packaging and Manufacturing 2002, State University of New York Binghamton University, October 21-23, 2002, Binghamton, NY.
"NEMI's Effort to Make Optoelectronics Manufacturing Mainstream," Alan Rae, Cookson Electronics, and Ron Gedney, NEMI, (presented at, and published in the proceedings of, SMTA - Optoelectronics and the Telecom Revolution, November 13-15, 2001, Dallas).
"Assembly Using Optoelectronic Packages," Alan Rae, Cookson Electronics, IMAPS 2001 Conference, September 24, 2001, Oslo, Norway.
NEMI Optoelectronics Workshop (summary of session sponsored by NEMI in conjunction with the IPC International Conference on Opto-Electronics, May 3-4, 2001, Toronto, Ontario).
Medical Electronics
2007 iNEMI Roadmap Processes/Medical PEG Sector Overview, presented by Chuck Richardson, MEPTEC Medical Electronics Symposium, September 21, 2006 (Arizona State University; Tempe, AZ)
Miscellaneous
PRESENTATION: Innovation Priorities for 2015, Bob Pfahl, iNEMI, 2006 IEEE Systems Packaging Japan Workshop, February 1, 2006, Hakone, Japan
Emerging Nanotechnology and Its Effect on Electronics Manufacturing, presented by Alan Rae NanoDynamics), Bob Pfahl (iNEMI), SMTA International, September 26, 2005 paper presentation
Sensor Technology Roadmapping Efforts at iNEMI, Charles E. Richardson (iNEMI); Ray Roop and Steve Hendry (Freescale Semiconductor); and Michael H. Azarian, Sanka Ganesan, and Michael Pecht (CALCE/University of Maryland), IEEE Transactions on Components and Packaging Technologies (Vol. 28, No. 2, pages 372-375). By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
Roadmap
Roadmapping the Electronics Industry: The iNEMI Process, ICEPT 2007 (August 14; Shanghai, China)
Roadmap Trends and Emerging Technologies, International Electronics Packaging Symposium (July 31; Niskayuna, New York)
Emerging Markets and Emerging Technologies, HDP'07 (June 27-28; Shanghai, China)
presentation
paper
iNEMI China and the Green Electronics Roadmap, Sino-European Workshop on Green Electronics Technology (June 26; Shanghai, China)
Celestica-iNEMI Technology Forum, May 15-16, 2007 (Toronto, Canada)
Keynote on 2007 Roadmap, presented at IPC Printed Circuits Expo/APEX/Designers
Summit 2007 (Los Angeles, CA), February 22, 2007:
2007 Roadmap Overview, Jim McElroy, iNEMI
Organic and Printed Electronics, Jie Zhang, Motorola
Celestica-iNEMI Technology Forum, May 15-16, 2007 (Toronto, Canada)
PRESENTATIONS: 2007 iNEMI Roadmap - Setting Industry's Technology Direction, SMT HYBRID Packaging 2007 (4/26/07, Nuremberg, Germany)
Highlights of the 2007 Roadmap, presented at China SMT Forum 2007 (Shanghai, China), March 23, 2007:
Presentation, Bob Pfahl, iNEMI
Paper, Bob Pfahl and Jim McElroy, iNEMI
Keynote on 2007 Roadmap, presented at IPC Printed Circuits Expo/APEX/Designers Summit 2007 (Los Angeles, CA), February 22, 2007:
2007 Roadmap Overview, Jim McElroy, iNEMI
Organic and Printed Electronics, Jie Zhang, Motorola
Technology Roadmaps: Driving Industry Collaboration, Chuck Richardson (iNEMI), September 26, 2006 (SMTAI, Rosemont, IL)
2007 iNEMI Roadmap Processes/Medical PEG Sector Overview, presented by Chuck Richardson, MEPTEC Medical Electronics Symposium, September 21, 2006 (Arizona State University; Tempe, AZ)
PRESENTATION: The iNEMI Roadmap, 2006 ITRS Public Conference, Bob Pfahl (iNEMI), July 12, 2006 (San Francisco).
The 2004 iNEMI Technology Roadmaps, Jim McElroy and Bob Pfahl (iNEMI), 7th IEEE CPMT International Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP '05), June 28, 2005 (Shanghai, China). paper presentation
Results from the 2004 iNEMI Environmentally Conscious Electronics (ECE) Roadmap, Mark Newton (Dell), Joe Johnson (Microsoft) and Robert C. Pfahl Jr. (iNEMI), 2005 IEEE International Symposium on Electronics & the Environment (ISEE) and Electronics Recycling SUMMIT, May 17, 2005 (New Orleans, LA)
2004 NEMI Roadmap 2004 NEMI Roadmap - Work In Progress: Identifying Technology / Business Drivers for the Automotive Industry, Chuck Richardson (NEMI), SMTA/CAVE Harsh Environment Electronics Workshop, July 20-21, 2004 (Dearborn, MI).
Closing Identified Technology Gaps: EIA/ECA Collaboration Opportunities on 2004 Roadmap, Chuck Richardson, 2004 Spring EIA/ECA Engineering Summit, April 20, 2004 (Tampa, FL).
Highlights of the 2002 National Electronic Manufacturing Technology Roadmaps And Their Applicability To China, Dr. Robert C. Pfahl Jr., Fifth International Conference on Electronic Packaging Technology (ICEPT), October 28, 2003 (Shanghai, China).
paper presentation
NEMI Technology Roadmaps: What's New for 2002, presented by Chuck Richardson (NEMI), September 24, 2003, SMTA International conference (Chicago, IL).
"NEMI Product Emulators: Roadmapping Industry Needs and Closing Technology Gaps," Robert Pfahl, NEMI, 2003 International Technology Roadmap for Semiconductors (ITRS) Conference, July 16, 2003, San Francisco.
"NEMI Optoelectronics Technology Roadmap," Dr. Laura J. Turbini, CMP, and John Stafford, JWS Consulting, OMI Conference, April 30, 2003, Ottawa, Canada.
"NEMI 2002 Roadmap Gap Analysis," Dr. Alan Rae, Cookson Electronics, OMI Conference, April 30, 2003, Ottawa, Canada.
"Highlights of the 2002 National Electronic Manufacturing Technology Roadmaps and their Applicability to China," Dr. Robert C. Pfahl Jr. NEMI, Fifth International Conference on Electronic Packaging Technology, April 21-23, 2003 Shanghai, China.
"The NEMI Roadmap: Integrated Passives Technology and Economics," Joe Dougherty, Penn State, et al, Capacitor and Resistor Technology Symposium (CARTS), March 31-April 3, 2003, Scottsdale, AZ.
"NEMI Technology Roadmaps - What's New for 2002?", Jim McElroy, NEMI, APEX 2003, April 2, 2003
"Technology Roadmap Overview," Chuck Richardson, presented to the Atlanta chapter of SMTA, September 19, 2002 at Georgia Institute of Technology, and to SMTA International, September 25, 2002, at the Donald Stephens Convention Center, Rosemont, Illinois.
"2002 ITRS/NEMI Assembly and Packaging Roadmap," Joe Adam, Skyworks Solutions, SEMICON Taiwan, September 17, 2002, Taipei, Taiwan.
APEX 2001 Keynote - NEMI Roadmap 2000 (January 17, 2001)
Supply Chain Communication
Presentations: NEMI Material Data Exchange Coordination Meeting, Berlin, Germany (September 9, 2004)
Material Declaration of Components and Electronic Assemblies: Data Exchange Solutions for Global Environmental Requirements (August 30-31, 2004; Santa Clara, CA)
PDX 2.0 (APEX 2004 meeting, February 24)
Agenda
Product Data eXchange Overview & Adoption, Richard Kubin (E2open), Chair, NEMI Business Leadership Team
PDX Use at Lucent Technologies, Butch Morel (Lucent)
Agile Software's Perspective on PDX, Dries D'hooghe (Agile)
PDX 2.0 Activities. Richard Kubin (E2open)
In Search of the Perfect Bill of Materials: Improving NPI Metrics, presented by Chuck Richardson (NEMI), September 22, 2003, SMTA International conference (Chicago, IL). (paper) (presentation)
"PCB Equipment Communication Standards Today and Tomorrow," Brian Rubow, Cimetrix, Inc., APEX 2003, April 2, Anaheim, CA.
"Lessons Learned from the IPC-2501 Testbed Prototype Performance Test at a Motorola Factory," D. Pattyn and M. Motherway, Motorola, APEX 2003, April 2, Anaheim, CA.
"Spanning the Virtual Factory - Managing Supply Chain Communications" (APEX 2003)
"Improving Communication for Product Realization," Jim McElroy (part of a panel on co-development), 2003 CoDev 2003: 2nd International PDMA/ MRT Congress on Co-Developing Products with Partners, Suppliers and Customers, January 28, 2003, Scottsdale, AZ.
"Improving Supply Chain Communications (Dismantling the Tower of Babel)," Jim McElroy, NEMI, and Barbara Goldstein, NIST, Convergence 2002 Transportation Electronics Conference, October 21, 2002, Detroit, MI.
Perfect Bill of Materials (BoM) web forum (July 17, 2002)
_____Presentation
_____Minutes
_____Whitepaper
"Spanning the Virtual Factory - Managing Supply Chain Communications" (APEX 2002)
CAD/CAM Data Convergence (APEX 2002)
"Supply Chain Partners in Collaboration - A Standardized Industry Approach" (APEX 2001)
Data Exchange Convergence Project (APEX 2001)
"A Standards-Based Approach to Integrating Information Across the Electronics Manufacturing Supply Network," Barbara Goldstein, NIST, Electronic Circuits World Convention 8 (ECWC8), September 1999, Tokyo, Japan.