Tin Whisker Test Committee Results (Phase 3), V. Schroeder (Hewlett Packard)

Whisker & Hillock Formation on Sn, Sn-Cu & Sn-Pb Electrodeposits, W. Boettinger (NIST)

Integrated Theory for Whisker Formation:  Kirkendall Effect and Whisker Formation, G. Galyon (IBM)

Stress Measurements in Thin Films

• Flexure Beam Analysis, S. Lal (FCI Connect)
  
  
• X-RD Measurements, Chen Xu (Cookson Electronics)

Film Crystallography and Whisker Formation, A. Frye (IBM)

Humidity Effects on Sn Whisker Formation, M. Dittes (Infineon)

A Statistical Study of Sn Whisker Population and Growth during Elevated Temperature and Humidity Storage Tests, Peng Su (Freescale Semiconductor)

Sn Corrosion and Its Influence on Whiskers, J. Osenbach (Agere)

Theory of Tin Whisker Growth - "The End Game," J. Smetana (Alcatel)

Tin Deposit Ripening and Whisker Growth, A. Egli (Rohm and Haas Electronic Materials)

Surface Structure Effects of Sn Electrodeposits on the Sn Whisker Growth, Kil-Won Moon (NIST)

Tin Whisker Accelerated Test Project Meeting (June 1, 2005)

Whisker Results from Whisker Investigations and the Corresponding Conclusions, Dr. Werner A. Hugel, Dr. Verena Kirchner, Moheb Nayeri, Dr. Lothar Henneken, and Rolf Keller, Robert Bosch GmbH