Projects

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Overview

iNEMI forms projects to address technology and infrastructure gaps identified through the consortium's roadmapping and gap analysis activities. iNEMI identifies areas: (1) that are not currently being addressed by other industry efforts, and (2) where members can collectively have an impact. Projects aim to eliminate gaps through:

• accelerated deployment of new technology
• development of industry infrastructure
• dissemination of efficient business practices
• stimulation of standards

Projects are organized within Technology Integration Groups (TIGs) and iNEMI membership is usually required for project participation.  

Click here to download the latest iNEMI projects booklet, which provides brief descriptions of all projects and initiatives.

Board Assembly TIG
- Board Coplanarity in SMT
- Characterization of Pb-Free Alloy Alternatives
- Pb-Free Early Failure
- Pb-Free Wave Soldering
- Solder Paste Deposition
- Surface Mount Assembly & Rework
New initiatives:
- Creep Corrosion
Completed projects:
- DPMO (Defective Parts per Million Opportunities)
- Nano-Attach
- Pb-Free Alloy Alternatives
- Pb-Free BGAs in SnPb Assemblies
- Pb-Free Nano-Solder
- Pb-Free Rework Optimization
- Test Strategy

Board and Systems Manufacturing Test TIG
New initiatives:
- Board Flexure Standardization - Phase II
- Boundary Scan Adoption - Phase II - Memory Device Test
- Built-In Self-Test
- Test Strategy Model Update
Completed projects:
- Board Flexure Standardization
- Boundary Scan Adoption
- Functional Test Coverage Assessment

Environmentally Conscious Electronics (ECE) TIG
- Eco-Impact Evaluator for ICT Equipment
- HFR-Free High-Reliability Project (joint with Organic PCB TIG)
- HFR-Free Leadership Program
     - HFR-Free PCB Material
     - HFR-Free Signal Integrity
Pb-Free Component & Board Finish Reliability (joint with Organic Packaging Substrates TIG)
New initiatives:
- Analytical Tin Whisker Test
- PVC Alternatives
Completed projects:
- BFR-Free: Design Phase (formerly Halogen-Free; joint with Substrates TIG)
- BFR-Free: Test Phase (formerly Halogen-Free; joint with Substrates TIG)
- High-Reliability RoHS Task Force 
- Lead-Free Assembly
- Lead-Free Assembly & Rework
- Pb-Free Rework Optimization
- RoHS Transition Task Group
     - Assembly Process Specifications
     - Component and Board Marking
     - Component Supply Chain Readiness
     - Materials Declarations
- Tin Whisker Accelerated Test
- Tin Whisker Modeling
- Tin Whisker User Group

Medical TIG
- Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors)
- Medical Substrates
Completed projects
- Medical Components Reliability Specifications, Phase 1

Optoelectronics TIG
New initiatives:
- Active Cables
- Manufacturing Challenges of High-Speed Optical Networks
- Optical Lens and Connector Cleanliness
Completed projects:
- Fiber Connector End-Face Inspection
- Fiber Connector End-Face Inspection, Phase II
- Fiber Handling
- Fiber Optic Signal Performance
- Fiber Optic Splice Improvement
- Fiber Optic Splice Loss Measurement
- Optoelectronics for Substrates (joint with Substrates TIG)

Organic Packaging Substrates TIG
- Pb-Free Component & Board Finish Reliability (joint with Organic Packaging Substrates TIG)
New initiatives:
- Initiatives from Organic Packaging Workshop (November 2009)
      - Warpage Qualification Criteria
      - Primary Factors in Warpage
      - Wiring Density Program
      - Holistic Modeling Process
      - Optimizing Time to Yield
      - Reliability Methodology for Substrates

Organic PCB TIG (new)
- BFR-Free High-Reliability PCB (joint with ECE TIG)

Former TIGs

Product Lifecycle Information Management (PLIM) TIG
Completed projects:
- Materials Composition Data Exchange
Previous Factory Information Systems (FIS) TIG Projects (completed)
- Data Exchange Convergence
- Plug & Play Factory
- Virtual Factory Information Interchange

Substrates TIG
Completed projects:
- BFR-Free: Test Phase (formerly Halogen-Free; joint with ECE TIG)
Completed projects:
- Advanced Embedded Passives Technology
- BFR-Free PCB: Design Phase (formerly Halogen-Free; joint with ECE TIG)
- High Frequency Material Effects on HDI Formation
- Optoelectronics for Substrates (joint with Optoelectronics TIG)