Projects
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Statement of Work - iNEMI Holistic Modeling Process for Packaging Substrates (Version 3.1, November 24, 2010)
Project Statement - iNEMI Holistic Modeling Process for Packaging Substrates (Version 3.1, November 24, 2010) (initial sign up has been extended to February 22, 2011)
Problem statement
- Develop a multilevel design tool to optimize package designs for electrical, mechanical, and thermal performance
- The initial scope would be limited to focus on one package type which is defined as a market need 2-4 years out in the future
- Package selected needs to be one which Application details and specs need to be provided from the OEM side. Coverage of multiple applications is desirable.
Objectives
- Identify critical materials properties and proposed specifications for a specific package type.
- Determine data depth/accuracy in critical materials properties required for model effectiveness.
- Develop a holistic approach by involving data experts from materials, packaging, and substrate suppliers
Expected output
- By improving performance of a single package, demonstrate that this consortia approach can achieve improved performance and competitive costs
Steps for joining the project
On November 2010, the iNEMI Technical Committee approved the SOW and Project Statement, thus beginning the corporate sign-up period for this project. The project will officially begin as soon as two iNEMI members sign the project statement. The period for becoming a founding member for this project will close on January 21, 2011.
For iNEMI members:
- Complete and sign the project statement
- Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to infohelp@inemi.org
For non-members:
Click here for more information about other Organic Packaging Substrates Initiatives.
Further information
Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org
Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org
