This is an invitation to participate in or lead one of the new initiatives proposed from the iNEMI Organic Packaging Substrates Workshop in Nagoya, Japan in November 2009.  Six areas for potential industry collaborative initiatives were identified at the workshop. Now we begin the effort of setting up the initial meetings to move those proposals forward.

New Initiative Opportunities (PDF)

Statement of Work Guidelines (PDF)

1.  Warpage Qualification Criteria (Substrates, Package and Board Levels)

2.  Identification of Primary Factors of Warpage

3.  Wiring Density Program
     1)  Materials
     2)  Lithography
     3)  Plating
     4)  Inspection and Test

4.  Holistic Modeling Process

5.  Optimization of Time to Yield (Design, Materials, Packaging)

6.  Reliability Methodology for Substrates

Anyone in the industry is welcome to join the Project Formation Teams in defining the elements, tasks and project timelines for each of these areas.

Press release

iNEMI Organizes Four New Packaging Initiatives (04/07/10)

If you have any questions, please contact:

Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org

Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org