New initiatives

1. Warpage
   a.  Identification of Qualification Criteria (Substrates, Package and Board Levels)
   b.  Identification of Primary Factors of Warpage
2. Miniaturization
   a.  Wiring Density Program
        1)  Materials
        2)  Lithography
        3)  Plating
        4)  Inspection and Test
3. Holistic Approach to Packaging
   a.  Development of Holistic Modeling Process
   b.  Optimization of Time to Yield (Design, Materials, Packaging)
   c.  Reliability Methodology for Substrates

Detailed initiatives from this workshop (PDF file)

We would like to know whether you would be willing to participate in the project definition phase of the Organic Packaging Substrates Initiatives identified during the iNEMI Packaging Substrate Workshop held in Nagoya, Japan. There will be 6 focus areas.  This survey will ask for your interest in the initiatives, followed by an opportunity to define which aspects of the initiatives you would like to participate in.

Click here to take the survey.

For further information:
Haley Fu
Asia
+86 21 5835 3839
haley.fu@inemi.org

Jim Arnold
U.S.
+1 480-854-0906
jim.arnold@rissastudios.com