Projects
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Statement of Work - Primary Factors in Component Warpage (Version 3.0; September 21, 2010)
Project Statement - Primary Factors in Component Warpage (Version 3.0, September 21, 2010) (initial sign up ends November 8, 2010)
Problem statement
Objectives
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Identify key material properties (core, core/SM thickness, substrate, design (Cu trace/via), package assembly) and key contributors (die size, thickness) which impacts 1st level and 2nd level for different applications
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Identify key process parameters (UF, MC, etc.), reflow profile, package pitch, PCB, environmental factors (shipping and storage; moisture effect) which impact warpage
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Establish understanding to modulate the key contributors
Expected output
- A set of primary parameters (materials, design and processes) and the working window to control the warpage through supply chain
- Recommendation / guidelines for shipping and storage
Click here for more information about other Organic Packaging Substrates Initiatives.
Steps for joining the project
On September 21, 2010, the iNEMI Technical Committee approved the SOW and Project Statement, thus beginning the corporate sign-up period for this project. The project will officially begin as soon as two iNEMI members sign the project statement. The period for becoming a founding member for this project will close on November 8, 2010.
For iNEMI members:
- Complete and sign the project statement
- Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to infohelp@inemi.org
For non-members:
Further information
Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org
Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org
