Click here for WebEx/telecon information

Problem statement

• A number of alternative packaging technologies, each covered by different specifications and reliability requirements are currently being used in Multichip packaging such as POP

• These specifications and requirements are also a function of market segment and OEM requirements

• This effort looks to develop an alternative approach to develop realistic requirements and specifications which benefit the entire supply chain

• Pick a market segment and/or product line as a pilot vehicle

• The scope of this first initiative should focus on one package type identified by the team

Objectives

• Cover details of reliability specs – life cycle, thermal cycles, shock test, etc.

• Good potential research cooperative project with universities

• OEMs to provide detailed specifications/requirements – mechanical and electrical

• Substrate suppliers to provide material properties early to support OEM simulations

• May require that new metrology be developed to support the reliability model

• New acceleration methods are highly desirable to shrink TTM

• Define interfacial & chemical properties – define metrology requirements and methods

Expected output

• Improved reliability specifications that focus on reliability issues of current technology rather than previous technology; thus improving reliability and reducing cost
• An industry wide consolidation of reliability specifications

Click here for more information about other Organic Packaging Substrates Initiatives.

Further information

Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org

Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org