Projects
Co-Chair: Robert Carson (Cisco Systems)
Co-Chair: Wei Keat Loh (Intel)
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Statement of Work - Package Qualification Criteria to Ensure Acceptable Warpage Performance for 2nd Level Assembly (Version 3.0; September 21, 2010)
Project Statement - Package Qualification Criteria to Ensure Acceptable Warpage Performance for 2nd Level Assembly (Version 3.0; September 21, 2010) (initial sign up ends November 8, 2010)
Problem statement
- Current standard is not adequate to predict good yield results at 1st and 2nd level assembly
- Measurement methods (dimensional and test) not common
Objectives
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Define the qualification method and criteria; e.g., sample size, precondition, variations of material and processes (1st and 2nd level)
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Establish measurement methods
Expected output
- Procedure and criteria reference for OEM and suppliers
Click here for more information about other Organic Packaging Substrates Initiatives.
Steps for joining the project
On September 21, 2010, the iNEMI Technical Committee approved the SOW and Project Statement, thus beginning the corporate sign-up period for this project. The project will officially begin as soon as two iNEMI members sign the project statement. The period for becoming a founding member for this project will close on November 8, 2010.
For iNEMI members:
- Complete and sign the project statement
- Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to infohelp@inemi.org
For non-members:
Further information
Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org
Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org
