Projects
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Statement of Work - iNEMI Wiring Density for Organic Packaging Substrates (Version 3.0, November 24, 2010)
Project Statement - iNEMI Wiring Density for Organic Packaging Substrates (Version 3.0, November 24, 2010) (initial sign up ends January 21, 2011)
Problem statement
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Meeting the wiring density needs of the next generation of packaging technology will require improvements in all areas of organic packaging substrates technology
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A piecemeal approach will not be sufficient
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This program will address each technology area with individual projects
Objectives
- The objective is to develop a system optimized next generation technology that focuses on the following prioritized technology areas to achieve maximized wiring density at minimal cost
- Material Set
- Low Cost Lithography / Laser
- Plating
- Inspection and Test
- Achieve these results by 2014
Expected output
- New materials, processes, and products that achieve a disruptive improvement in wiring density without increased cost
Steps for joining the project
On November 2010, the iNEMI Technical Committee approved the SOW and Project Statement, thus beginning the corporate sign-up period for this project. The project will officially begin as soon as two iNEMI members sign the project statement. The period for becoming a founding member for this project will close on January 21, 2011.
For iNEMI members:
- Complete and sign the project statement
- Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to infohelp@inemi.org
For non-members:
Click here for more information about other Organic Packaging Substrates Initiatives.
Further information
Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org
Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org
