Chair: Hamid Azimi (Intel Corporation)

Active projects:
   - Pb-Free Component and Board Finish Reliability (joint with the Environmentally Conscious Electronics TIG)

New initiatives:
   - Initiatives from Organic Packaging Substrates Workshop (November 17-18, 2009; Nagoya, Japan)
         - Warpage Qualification Criteria
         - Primary Factors in Warpage
         - Wiring Density Program
         - Holistic Modeling Process
         - Optimizing Time to Yield
         - Reliability Methodology for Substrates