Chair: Ian Williams (Intel Corporation)
Active projects:
- Pb-Free Nano-Solder
- Warm Assembly
- Nano-Attach
New initiatives:
- Characterization of Pb-Free Alloy Alternatives
- Board Coplanarity in SMT
- Pb-Free Component & Board Finish Reliability (joint with the Substrates TIG)
- Pb-Free Early Failure
- Pb-Free Rework Optimization Project - Phase 3 - Reliability Evaluation
- Solder Paste Deposition
Completed projects:
- Pb-Free Alloy Alternatives
- DPMO (Defective Parts per Million Opportunities)
- Pb-Free BGAs in SnPb Assemblies
- Test Strategy
