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iNEMI » cms » projects » ba » test_strat.html
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Projects
Test Strategy Project As the number of solder joints on printed circuit assemblies (PCAs) has increased, so has the potential for defects, thereby increasing the need for both test coverage and process improvement. The electronics manufacturing industry needs test and measurement solutions to address loss of physical access and fault coverage at in-circuit test (ICT). Manufacturers also need improved process measurement capabilities to enable higher levels of quality and efficiency in order to reduce conversion costs. iNEMI's Test Strategy Project addressed these challenges through investigation of automated X-ray inspection (AXI) (2D, 3D and partial 3D) and ICT fault coverage and performance. Activities were organized into three working groups: (1) Test Coverage Analysis, (2) Test Vehicle Analysis, and (3) Test Strategy Return on Investment Model. The team found that many ICT probe removal techniques allow significant probe reduction with an insignificant decrease in defect coverage. AXI demonstrated the highest defect coverage; therefore, the team recommended a combination of AXI inspection with other techniques to achieve the highest ICT probe removal strategies. The Test Strategy Project also developed a simple cost modeling tool that can be used to define a manufacturing PCA test strategy by estimating the cost of finding and repairing manufacturing assembly defects using various types of test and inspection strategies. This economic model helps communicate the potential needs and benefits of each test technique and helps users understand the impact of removing test stages vs. sampling strategies vs. 100% inspection or test methods. NEMI Test Strategy Cost Model (Rev 1.0) Press releases
Presentations Manufacturing Test Strategy Cost Model, Rosa D. Reinosa and Carlos Michel, Hewlett-Packard Company, International Test Conference (ITC), Board Test Workshop, October 3, 2003 (Charlotte, NC). paper presentation |
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