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Overview
Board Assembly
Board & Systems Manufacturing Test
Environmentally Conscious Electronics
Medical
Optoelectronics
Product Lifecycle Information Management
Organic Packaging Substrates
Organic PCB
Deployment Status Reports
Project Webinars & Reports

Projects
HFR-Free High-Reliability PCB Project (formerly BFR-Free)
(joint with the Substrates TIG)



SOW and Project Statement

Statement of Work (Version 7.0, August 4, 2008)

Project Statement (Version 4.0, August 4, 2008) (Sign up ends Friday, October 3)


Proposed project objectives

This group proposes the evaluation of key electrical and mechanical properties, focusing on those attributes that are of greatest value to the supply chain.

•  Build on industry knowledge and capability and Phase II (Test) of the iNEMI BFR-Free PCB Project (formerly Halogen-Free)
•  Consider unique market segment requirements
•  Identify technology readiness and gaps
•  Stimulate supply capability
•  Determine BFR-free board-level reliability for various components

Presentations

iNEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation), April 2, 2008; IPC Circuits Expo, APEX and the Designers Summit 2008 (Las Vegas, Nevada)

iNEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation),  updated version, April 15, 2008

Related iNEMI projects 
    BFR-Free PCB Project: Design Phase (formerly Halogen-Free, Phase I) (completed)
    BFR-Free PCB Project: Test Phase (formerly Halogen-Free, Phase II)

For additional information   
    David Godlewski
    iNEMI Staff Manager of Planning
    Phone:  717-651-0522
    Email:  dgodlewski@nemi.org