Projects
Chair: Stephen Tisdale (Intel Corporation)
Statement of Work and Project Statements for Sign-Up
Statement of Work: iNEMI HFR-Free Technology Leadership Program (Version 5.0; May 15, 2009)
Project Statement: HFR-Free PCB Materials Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)
Project Statement: HFR-Free Signal Integrity Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)
Please fill out and sign Project Statement(s) above and fax to +1 703-834-2735 or email to infohelp@inemi.org.
Order presentations from the Symposium on Global ICT Environmental Initiatives (October 27-28, Brussels)
iNEMI paper on HFR-free receives a best paper award from SMTA China (August 2009)
iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09)
Click here for presentations from the April 15 meeting in Taiwan
Several major OEMs are evaluating a conversion to HFR (halogenated flame retardant)-free PCB materials. While mobile phone manufacturers are well along in this effort, the next area of impact will likely be driven by high-volume consumer computer applications.
An industry-wide conversion to HFR-free materials faces numerous challenges:
- Reliability of materials with alternative flame retardants has not been fully qualified.
- Complete "technology envelopes" or technical specifications have not been established for various product applications.
- Incomplete design knowledge in segments of the supply chain increases risk of conversion issues.
- A rapid complete conversion of computer products will have a major impact on the supply chain and needs to be coordinated.
iNEMI is working with several of our major OEM members to assess the feasibility of a broad conversion to HFR-Free PCB materials. While IPC and JEDEC are developing halogen-free standard specifications and numerous companies have compliant materials, significant questions remain regarding overall readiness to make a transition to these materials. For example:
- What electrical properties are needed to meet high-speed signaling requirements?
- With many HFR-free materials showing higher stiffness, what mechanical properties are needed to ensure system reliability isn't degraded?
- Can design modifications reduce sensitivity to electrical and material properties?
To date, two initiatives have been established:
These two initiatives are meeting bi-weekly to generate Statements of Work (SOWs) and Project Statements (PSes).
Upcoming meetings & teleconferences
Press releases
iNEMI HFR-Free Leadership Program Launches with 22 Companies Participating (08/03/09)
iNEMI Members Release Position Statement on the Definition of “Low Halogen” for Electronic Products (07/01/09)
iNEMI Organizes New Program to Support Supply Chain Conversion to HFR-Free PCBs (03/31/09)
Draft Statement of Work
iNEMI HFR-Free Development of Technology Envelopes Project (Draft Version 2.4, January 15, 2009)
Presentations & background materials
Taipei meeting (April 15, 2009)
Santa Clara meeting (February 18, 2009)
Presentations
Introduction
HFR-Free Technology Envelope Project
Signal Integrity break-out
PCB Material break-out
Reports & minutes
Signal Integrity report
PCB Material report
Minutes
Other iNEMI HFR-free projects
HFR-Free PCB Material Evaluation
HFR-Free High-Reliability PCB
For additional details:
Jim Arnold
jim.arnold@rissastudios.com
+1 480-854-0906
