Projects

Chair: John Davignon (Intel Corporation)

Statement of Work and Project Statements for Sign-Up

Statement of Work: iNEMI HFR-Free Technology Leadership Program (Version 5.0; May 15, 2009)

Project Statement: HFR-Free PCB Materials Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)

Project Statement: HFR-Free Signal Integrity Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)

Please fill out and sign Project Statement(s) above and fax to +1 703-834-2735 or email to infohelp@inemi.org.

Order presentations from the Symposium on Global ICT Environmental Initiatives (October 27-28, Brussels)
iNEMI paper on HFR-free receives a best paper award from SMTA China (August 2009)

iNEMI Members Release Position Statement on the Definition of “Low Halogen” for Electronic Products (07/01/09)

iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09)

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for upcoming teleconferences
The goal of this new initiative is to identify technology limitations involved in transitioning to HFR-free PCB materials. After identifying commercially viable materials, the team will identify key mechanical performance characteristics and determine if they are in the critical path for the halogen-free PCB material transition. The initial focus will be on delamination, via and PTH reliability, pad cratering, and solder joint reliability. This project will identify the technical risks, flag unexplored issues and make recommendations for future work. The project will also assess manufacturing capability and supply capacity.

Presentations & background information

Related projects
- HFR-Free Signal Integrity

For additional details
Jim Arnold
jim.arnold@rissastudios.com
+1 480-854-0906