Chair: Stephen Hall (Intel Corporation)
Co-Chair: David Senk (Cisco)

Statement of Work and Project Statements for Sign-Up

Statement of Work:  iNEMI HFR-Free Technology Leadership Program (Version 5.0; May 15, 2009)

Project Statement:  HFR-Free PCB Materials Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)

Project Statement:  HFR-Free Signal Integrity Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)

Please fill out and sign Project Statement(s) above and fax to +1 703-834-2735 or email to infohelp@inemi.org.

Click here for upcoming teleconferences

This new effort will focus on ensuring there is no degradation of electrical signals in HFR-free PCB materials. Plans are to investigate the critical electrical parameters of new HFR-free materials. The team will identify candidate materials, review prior work to define key performance characteristics and test criteria, and design test vehicle(s) and test methodologies, leveraging standards where possible. The project will also assess technology readiness and identify gaps, plus assess manufacturing capability and supply capacity.

Presentations

HFR-Free Material - Dk/Df Test Method Proposal, presented by Scott Hinaga (Cisco Systems, Inc. PCB Technology Group), April 30, 2009

Two initial meetings of the HFR-Free Leadership Program were conducted on January 20 and February 18, 2009.  These meetings focused on Signal Integrity and PCB Material. Click here for background, presentations and minutes from these meetings.

Related projects
  - HFR-Free PCB Material

For additional details
Jim Arnold
jim.arnold@rissastudios.com
+1 480-854-0906